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Headline (June 2009) Sign Up for SoC News Alert  |
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| Articles for the Week of Jun. 29, 2009 | |
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Featured Article
Embedded Software Architecture Specification Developments in Support of SoC Design and Re-useThis paper reviews the open literature on general software architecture highlighting techniques applicable to the embedded domain. These areas include use of multiple views, hierarchical patterns, standard modeling, advanced documentation and application of architecture assistance tools. Applying software architecture for embedded re-use is an area identified as not being fully explored in current literature. |
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| Articles for the Week of Jun. 25, 2009 | |
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Featured Article
SuperSpeed USB 3.0: Ubiquitous Interconnect for Next Generation Consumer ApplicationsTo address the bandwidth limitations of the USB 2.0 interface, the USB Implementers Forum (USB-IF) released the SuperSpeed USB 3.0 specifications in November 2008. The USB 3.0 specification provides a maximum bandwidth of up to 5Gbps while limiting power consumption. In this white paper we present the features of the USB 3.0 protocol, discuss the new usage models it enables and compare it with some of the existing interface standards popular in the market today. |
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| Articles for the Week of Jun. 18, 2009 | |
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Featured Article
Generic and Automatic Specman based Verification Environment for Image Signal Processing IPsIn this paper, we present a generic and automatic Specman based verification environment for the verification of the image signal processing IPs. Specman based coverage driven random verification is very powerful methodology for the verification of IPs. However, it requires strong knowledge of ‘e’ language. The main aim of development of this verification environment is to more efficiently verify each image signal processing IP (both at module level and sub-system level) which have standard register interface(s) and video data interface(s). |
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| Articles for the Week of Jun. 11, 2009 | |
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Featured Article
Tailored SoC Building Using Reconfigurable IP BlocksIncreasing complexity, faster changing standards and shorter time to market ask for composing systems out of standard IP components. An example shows the construction of a System-on-Chip (SoC) based on standard IP components for a Digital Audio Broadcasting consumer application. |
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| Articles for the Week of Jun. 04, 2009 | |
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Featured Article
From IP re-use to open Innovation - A new trend in the industryThe purpose of this article is to show that beyond IP reuse a new trend is taking shape in the industry: Open Innovation. More than IP, companies now shares ideas which become the basis of their new product. A short description of the Procter&Gamble case will give a better understanding of this model. Some other examples in the high tech industry illustrate implementation of this model. Even if very appealing there is some important challenges around Open Innovation that new adopters have to be well aware. |
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