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Structured ASICs are a new breed of custom device that approach the performance of today's Standard Cell ASIC while dramatically simplifying the design complexity. Structured ASICs offer designers a set of devices with specific, customizable metal layers along with predefined metal layers, which can contain the underlying pattern of logic cells, memory, and I/O. By virtue of the predefined structures, the ASIC vendor can design any time-consuming task — such as test, signal integrity and IR drop — into the architecture. This corner will bring to your attention the latest News, latest products, latest initiative in this field. Featured Products: Structured ASIC Platforms, Structured ASIC based platform from Faraday Technology Corporation NetComposer-I FIC6010, Faraday Programmable Network Platform from Faraday Technology Corporation VCA-5, Ultra Wideband Array from Triad Semiconductor VCA-4, Low-Power, Nonvolatile Platform from Triad Semiconductor VCA-3, Low-Cost Analog Platform from Triad Semiconductor VCA-1, General-Purpose Mixed-Signal Via-Configurable Array from Triad Semiconductor VCA-6, FPGA Conversion Platform with High-Speed ADC/DAC from Triad Semiconductor ISSP1-STD, The standard Instant Silicon Solution Platform ™ from NEC Electronics Corp. ISSP90, The Instant Silicon Solution Platform ™ on 90 nm CMOS technology from NEC Electronics Corp. ISSP1-HSI, The High-performance Instant Silicon Solution Platform ™ from NEC Electronics Corp. More ...

Sponsor Link: NRE-free Structured ASICs Low unit cost No minimum order quantity 10x lower power consumption than FPGAs 3-4 week turnaround Built-in clock tree, scan chain and power distribution Variety of user I/Os Soft IP portfolio, including: RM926EJTM PIP-AMBA Tri-mode Ethernet MAC PCI Express DDR/DDR2 controller SERDES Register to win a free ARM926EJ development board Latest News: GigOptix Reduces System-on-Chip Risk and Slashes Development Costs With Its New CX7800 65nm Hybrid ASIC (Dec. 09, 2009) eASIC announces NEW ASIC-in-a-box Design Kits (Sep. 29, 2009) eASIC and IPextreme Announce Freescale ColdFire Processors for Nextreme NEW ASICs (Jun. 16, 2009) eASIC Accelerates DSP Market Momentum with New IP cores (May. 07, 2009) Triad Semiconductor Introduces Mocha Family to Extend Via-Configurable Array Benefits to Mixed-Signal ASIC Design (Mar. 02, 2009) Industry Articles : How to achieve design flexibility for free using Structured ASIC approaches (Mar. 27, 2008) Viewpoint: Embrace platform-based design (Nov. 29, 2007) Using customizable MCUs to bridge the gap between dedicated SoC ASSPs, ASICs and FPGAs: Part 1 (Jun. 14, 2007) Nextreme Structured ASICs: An alternative for designing cost-optimized ARM926EJ processor-based embedded systems (Mar. 19, 2007) ''Do's and Don'ts" when considering an FPGA to structured ASIC design methodology (Aug. 28, 2006)