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Cadence Design Systems, Inc.
CORE COMPETENCY:Acceleration and Emulation, Analog Design, Analog Simulation, Gate Level Simulation, Gate Level/Transistor Level Design, RF Design and Simulation, Enterprise Tools, Interoperability Tools, ASIC Layout, Custom Layout, Delay Calculation, DRC, Extractors, FPGA/PLD, IC DFM Tools, IC Implementation, IC SPICE and SPICE-like Simulation, Lithography, Mask Design, MCM, Hybrid and Packaging Design, Metal - Migration Analysis, PCB CAM, PCB Design, PCB SPICE, PCB Virtual Prototype, Physical Libraries, Power Analysis, Process Migration, RET, Reverse Synthesis, Signal - Integrity Analysis, Thermal Analysis, Timing Analysis, Compiler, ESL Co-Verification, ESL Design and Entry, ESL Logic Synthesis, ESL Power Analysis, ESL Simulation, ESL Test and Verification, DSP, Memory, MEMS, Networking, Telecomms, Wireless, Design IP, Verification IP, Design Services, Training and Consulting, Silicon Virtual Prototype, Synthesis, Verilog Simulation, VHDL Simulation, Timing Design, Verification, Thermal Design, Acceleration and Emulation, DFT Tools, Formal Analysis, Formal Verification, HW/SW Co-Verification, Intelligent Test Bench, Mixed Language Simulation, Mixed Signal Simulation, Power Design, RTL Design and Entry, Signal-Integrity Design Headquarter: United States | Founded: 1988 | Size: 5200 employees |
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Mentor Graphics Corp.
EDA Technology Leader CORE COMPETENCY:Acceleration and Emulation, Analog Design, Analog Simulation, Gate Level Simulation, Gate Level/Transistor Level Design, RF Design and Simulation, Schematic Capture, Design Libraries, Enterprise Tools, Custom Layout, Delay Calculation, DRC, EMI Analysis, Extractors, FPGA/PLD, IC DFM Tools, IC Implementation, IC SPICE and SPICE-like Simulation, Library Development Tools, Lithography, Mask Design, MCM, Hybrid and Packaging Design, PCB CAM, PCB Design, PCB SPICE, PCB Virtual Prototype, Physical Libraries, RET, Signal - Integrity Analysis, Thermal Analysis, Timing Analysis, Compiler, Debugger, ESL Co-Verification, ESL Design and Entry, ESL Logic Synthesis, ESL Simulation, ESL Test and Verification, Libraries, RTOS, DSP, Memory, Networking, Telecomms, Wireless, Design IP, Verification IP, Training and Consulting, Synthesis, Verilog Simulation, VHDL Simulation, Verification, Acceleration and Emulation, DFT Tools, EMI Design, Formal Analysis, Formal Verification, HW/SW Co-Verification, Mixed Language Simulation, Mixed Signal Simulation, Power Design, RTL Design and Entry, Signal-Integrity Design Headquarter: United States | Founded: 1981 | Size: 4200 employees |
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Sigrity, Inc.
Achieve What Others Can't CORE COMPETENCY:EMI Analysis, Extractors, IC Implementation, IC SPICE and SPICE-like Simulation, MCM, Hybrid and Packaging Design, PCB Design, PCB SPICE, Power Analysis, Signal - Integrity Analysis, Training and Consulting, Power Design, Signal-Integrity Design Headquarter: United States |
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Nimbic (formerly Physware)
CORE COMPETENCY:RF Design and Simulation, EMI Analysis, Extractors, MCM, Hybrid and Packaging Design, PCB Design, Power Analysis, Signal - Integrity Analysis Headquarter: United States |
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OptEM Engineering Inc.
Software and Services for Electronic Interconnect Design, Modeling and Analysis CORE COMPETENCY:Analog Design, Analog Simulation, Gate Level Simulation, Gate Level/Transistor Level Design, RF Design and Simulation, Extractors, IC SPICE and SPICE-like Simulation, MCM, Hybrid and Packaging Design, PCB Design, Signal - Integrity Analysis, Timing Analysis, Memory, MEMS, Networking, Telecomms, Wireless, Design Services, Training and Consulting, Verification, Mixed Signal Simulation, Signal-Integrity Design Headquarter: Canada |
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OEA International, Inc.
The Gold Standard for Accurate Parasitic Extraction & Signal Integrity Solutions CORE COMPETENCY:Analog Design, Analog Simulation, RF Design and Simulation, ASIC Layout, Extractors, MCM, Hybrid and Packaging Design, PCB Design, Power Analysis, Signal - Integrity Analysis, Timing Analysis, Synthesis, Timing Design, Mixed Signal Simulation, Power Design, Signal-Integrity Design Headquarter: United States |
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Intellitech Corp.
The Technology Leader in Scan Based Debug, Configuration and Test CORE COMPETENCY:FPGA/PLD, MCM, Hybrid and Packaging Design, PCB Design, Debugger, ESL Test and Verification, DSP, Memory, Networking, Telecomms, Wireless, Design IP, Verification IP, Design Services, DFT Tools Headquarter: United States | Founded: 1988 |
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EMA Design Automation, Inc.
CORE COMPETENCY:Analog Design, Analog Simulation, Gate Level Simulation, Gate Level/Transistor Level Design, RF Design and Simulation, Schematic Capture, Design Libraries, ASIC Layout, Custom Layout, Delay Calculation, DRC, FPGA/PLD, IC DFM Tools, IC Implementation, IC SPICE and SPICE-like Simulation, Library Development Tools, MCM, Hybrid and Packaging Design, PCB CAM, PCB Design, PCB SPICE, Power Analysis, Signal - Integrity Analysis, Thermal Analysis, Timing Analysis, Training and Consulting, Synthesis, Verilog Simulation, VHDL Simulation, Timing Design, Verification, Formal Analysis, Mixed Language Simulation, Mixed Signal Simulation, Power Design, RTL Design and Entry, Signal-Integrity Design Headquarter: United States |
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Artwork Conversion Software, Inc.
CAD Translators, Plotting and PostProcessing CORE COMPETENCY:Extractors, Lithography, Mask Design, MCM, Hybrid and Packaging Design Headquarter: United States |
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Applied Wave Research, Inc.
CORE COMPETENCY:Analog Design, Analog Simulation, RF Design and Simulation, Schematic Capture, Design Libraries, Custom Layout, DRC, EMI Analysis, IC Implementation, IC SPICE and SPICE-like Simulation, Library Development Tools, MCM, Hybrid and Packaging Design, PCB Design, PCB SPICE, ESL Simulation, Mixed Signal Simulation, Signal-Integrity Design Headquarter: United States |
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ANSYS
CORE COMPETENCY:Analog Design, Analog Simulation, Gate Level Simulation, Gate Level/Transistor Level Design, RF Design and Simulation, Schematic Capture, Design Libraries, Enterprise Tools, Interoperability Tools, EMI Analysis, Extractors, IC SPICE and SPICE-like Simulation, MCM, Hybrid and Packaging Design, Power Analysis, Signal - Integrity Analysis, Thermal Analysis, Memory, MEMS, Networking, Telecomms, Wireless, Signal-Integrity Design Headquarter: United States |
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