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Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC’s Link for 3D die stacking) for the TSMC 3DFabric ... Read
Global IP Core Sales - The DVB-S2X LDPC Decoder is a powerful FEC core decoder for Digital Video Broadcasting via Satellite. It implements extensions ... Read
Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain ...
Dolphin Design, a pioneer in silicon IPs specializing in power-management, Audio and Very Edge Computing with AI capabilities, announces it is expanding ... Read
Partner Highlight
M31 Technology, a leading global provider of silicon intellectual property (IP), announced that its 5nm advanced process IP solution for high-speed interface ... Read
Faraday Technology announced it is leveraging the latest Arm® Automotive Enhanced (AE) technology, licensing the Cortex®-A720AE IP to drive the development ... Read
JEDEC Updates JESD79-5C DDR5 SDRAM Standard: Elevating Performance and Security for Next-Gen ...
EDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced publication of ... Read
Industry Expert Blogs
Eric Esteve, IPnest
Tim Thornton, Arm
By Tomer Yablonka, Ceva
Vinod Khera, Cadence
Industry Articles
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Embracing a More Secure Era with TLS 1.3
Lawrence Liu
PUFsecurity -
New PCIe Gen6 CXL3.0 retimer: a small chip for big next-gen AI
Anton Shilov
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Maximizing ESD protection for automotive Ethernet applications
Andreas Hardock
Nexperia -
The role of cache in AI processor design
Frank Schirrmeister
Arteris -
Time Sensitive Networking for Aerospace
CAST and Fraunhofer IPMS
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Understanding mmWave RADAR, its Principle & Applications
Snehal Buche
eInfochips -
Advanced Topics in FinFET Back-End Layout, Analog Techniques, and Design Tools
AsicNorth
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Maximizing Performance & Reliability for Flash Applications with Synopsys xSPI Solution
Lakshmi Jain
Synopsys