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Gary Smith at DAC 2012: Multi-Platform Design and the $40M System on ChipIndustry Insights Blog - Richard Goering , CadenceJun. 04, 2012 |
Veteran EDA analyst Gary Smith started his annual Design Automation Conference (DAC 2012) presentation with three simple words: "I was wrong." Wrong, that is, about last year's observation that it takes $75 million or more to design the average high-end mobile semiconductor design. Smith discovered a new way to design that cuts that cost considerably, and it's called "multi-platform design."
In the same presentation, given Sunday evening June 3, Smith noted that the EDA industry grew by 12% in 2011 and said that electronic system level (ESL) design grew by an outstanding 75%. So perhaps last year was the long-awaited "year of ESL." This year, Smith said, may be the year of the silicon virtual prototype.
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