Industry Expert Blogs

As system on chip designs grow more complex, it becomes more and more difficult for chip companies to optimize the work of their distributed design teams. While each separate team has an area of expertise and sets their focus on a particular aspect of the SoC, the hard part comes in integrating these individual design efforts together. When something goes wrong and it doesn’t work, the company’s critical time to market advantage starts to slip.

The problem arises because chipmakers split up design tasks so each team works to the strengths of its expertise. One team will design the basic architecture at headquarters and then parcel out the graphics portion to Design Team A. Design Team B gets to work on the processor complex and Design Team C is set to optimize video and audio processing. But the connectivity portion of the chip has to work with all the other subsystems. When each individual team completes its work in meeting performance goals and design constraints, then a designated interconnect team has the task bringing all this work back together into the final SoC.

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