IBM to offer CMOS image sensor foundry services
EE Times: Latest News IBM to offer CMOS image sensor foundry services | |
Spencer Chin (07/13/2005 10:18 AM EDT) URL: http://www.eetimes.com/showArticle.jhtml?articleID=165701930 | |
MANHASSET, N.Y. — IBM Corp. has announced it would make available technology and manufacturing services for complementary metal oxide semiconductor (CMOS) image sensors for use in camera-phones, digital still cameras and other consumer products. IBM (Armonk N.Y.) announced a CMOS image sensor development and manufacturing collaboration with Kodak last September, which included the license of Kodak CMOS image sensor fabrication intellectual property to IBM. Kodak has announced new three- and five-megapixel CMOS image sensors qualified and manufactured for Kodak by IBM's semiconductor plant in Burlington, Vt., that utilize this process. IBM's foundry offering is based on IBM's 0.18-micron copper CMOS manufacturing process, available at its Burlington facility, that features an integrated design kit, including a four-transistor, 3-micron pixel with a pinned diode, and access to IBM's image sensor circuit library. According to IBM, the sensors' image quality can be improved through the company's ability to produce sensors with a 2.5-micron copper stack incorporating an on-chip color filter and microlens. The copper stack is approximately 30 percent thinner than standard aluminum-based processes, which IBM said can significantly improve light collection efficiency (quantum efficiency) for improved picture quality in low light.
| |
All material on this site Copyright © 2005 CMP Media LLC. All rights reserved. Privacy Statement | Your California Privacy Rights | Terms of Service | |
Related News
- IBM announces new CMOS image sensor foundry offering
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass-Produced
- Andes Technology and MetaSilicon Collaborate to Build the World's First Automotive-Grade CMOS Image Sensor Product Using RISC-V IP SoC
- Mixel MIPI D-PHY IP Integrated into Teledyne e2v's new Topaz CMOS Image Sensors
- Cista Design Inc. Selects Kilopass OTP NVM for Next Generation CMOS Image Sensor on SMIC Independently Developed 130nm Back Side Illumination Technology Platform
Breaking News
- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
- Rambus Advances AI 2.0 with GDDR7 Memory Controller IP
- Faraday Reports First Quarter 2024 Results
- RAAAM Memory Technologies Closes $4M Seed Round to Commercialize Super Cost Effective On-Chip Memory Solutions
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
E-mail This Article | Printer-Friendly Page |