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CEVA Xpert-Teak DSP Subsystem Powers National Semiconductor's New CP3SP33 Telematics Chip Targeting Analog-Rich Automotive Multimedia Applications
Xpert-Teak Delivers Audio, Modem and Speech Recognition Functionality in National's High-Performance Integrated Analog Circuit SAN JOSE, Calif. -- Oct. 19, 2005 -- CEVA Inc., (Nasdaq: CEVA; LSE: CVA), the leading licensor of digital signal processors (DSP) cores, multimedia, GPS and storage platforms to the semiconductor industry, announced today that National Semiconductor Corporation has deployed CEVA's Xpert-Teak DSP subsystem in its latest generation chipset optimized for Bluetooth(R) and non-Bluetooth handsfree systems as well as telematics platforms (such as head sets) and automotive multimedia gateways. National's high-performance CP3SP33SMR utilizes Xpert-Teak to perform audio, modem and speech recognition functions within the chip. "Xpert-Teak provides us with a low-power, high-performance DSP subsystem on which to run complex algorithms for acoustic echo cancellation, noise reduction and audio decoding, integral to the CP3SP33SMR," said Pat Sullivan, product line director for National's Device Connectivity Division. "Our long heritage and wealth of experience with CEVA ensured that integration of its DSP technology into yet another generation of our embedded integrated circuits went exactly as planned." "National's deployment of Xpert-Teak in its CP3SP33SMR for telematics emphasizes the continued adoption of CEVA DSP technologies in high-growth markets," said Federico Arcelli, Vice President of Corporate Marketing, CEVA Inc. "This latest CEVA-powered chip from National represents another significant milestone for the successful relationship between the two companies and is testament to the industry-leading power and performance capabilities of our DSP cores." The Xpert-Teak subsystem is a complete, licensable, DSP subsystem for low- power, low-cost, programmable, DSP-based SoC designs targeted at low-power and high performance applications such as wireless baseband and application processing, digital cameras, consumer and professional audio, VoIP applications and other emerging markets. Built around CEVA's widely adapted dual-MAC CEVA-Teak DSP Core, it is fully synthesizable and process- independent, and can be incorporated into a highly integrated SoC. Xpert-Teak includes all required hardware peripherals and incorporates on- chip data and program memories, high-performance DMA controller, Buffered Time Division Multiplexing Port (BTDMP), high-throughput Host Processor Interface (HPI), and other interfaces. The subsystem can be used with off-the-shelf software provided by CEVA and its technology partners. About CEVA, Inc. Headquartered in San Jose, Calif., CEVA is the leading licensor of DSP cores, multimedia, GPS, and storage platforms to the semiconductor industry. CEVA licenses a family of programmable DSP cores, associated SoC system platforms and a portfolio of application platforms including video processing, audio and speech processing, GPS location, Serial-ATA (SATA), and serial communications. In 2004, CEVA's Silicon IP was shipped in more than 100 million devices. CEVA was created through the merger of the DSP licensing division of DSP Group and Parthus Technologies. For more information visit http://www.ceva-dsp.com
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