TransEDA accelerates IPO timetable
TransEDA accelerates IPO timetable
By Peter Clarke, EE Times
September 27, 2000 (12:28 p.m. EST)
URL: http://www.eetimes.com/story/OEG20000927S0038
LONDON Shares of TransEDA Ltd. will begin trading on the London Stock Exchange on Thursday (Sept. 28), after the company's initial public offering was moved from the first week of October. The share price has been set at 50 pence about 75 cents according to Ellis Smith, chief executive officer of TransEDA (Eastleigh, England). Nearly 41 million shares have been placed with more than 30 institutional investors in London and elsewhere, representing about 80 percent of the company, Smith said. The shares will be traded on the Alternative Investment Market (AIM) of the London exchange. TransEDA's offering is now set to value the company at $30 million to $35 million and to raise approximately $4 million for further product development and expansion. "The AIM float is attractive to us because you can issue shares up to the value of your company without shareholder approval," Smith said. "It means acquisitions can be done much faster than if you had to get shareholder approval." Founded in 1992, TransEDA develops and sells software used to verify circuit design descriptions. Its functional-verification tools perform code coverage, test suite optimization, state machine verification and rule checking.
Related News
- TransEDA accelerates SoC verification with industry's first emulation coverage solution
- IPO part of TransEDA's acquisition strategy
- TransEDA Again Accelerates System-On-Chip Verification with New Version of its Verification Navigator Environment <!-- verification -->
- Arm Accelerates Edge AI with Latest Generation Ethos-U NPU and New IoT Reference Design Platform
- Trilinear Technologies Accelerates Innovation in Automotive Display Connectivity with DisplayPort Automotive Extensions Standard (DP AE)
Breaking News
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
- Rambus Advances AI 2.0 with GDDR7 Memory Controller IP
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |