Design Reuse
Search EETimes
Silicon IP Verification IP Software IP Wanted IP !!! Free Download IP Analytics (Restricted Access) FPGA Board / Kit Design Services Foundries Main IP/SoC Products Embedded Systems Design Platform / Structured ASIC Foundries FPGA / CPLD Fabless / IDM Deals Legal Business Financial Results People ESL Design Commentary / Analysis Main Silicon IP / SoC Verification IP FPGA / CPLD Embedded Systems Design Platform / Structured ASIC ESL Design ESL Design Standards & Best Practice Structured ASIC Verification IP Main On Cores Multimedia IP Journal Embedded Systems EDA Tools IP Cores Tool Demos D&R Partners Research / Market Reports Events Calendar Webcasts / Podcasts Online Bookstore


ViASIC Introduces Industry's First Two-Mask Standard Metal Fabric for Re-configurable SOC Design; DuoMask Patented Technology Provides a Complete Solution for All Processes


Related

ViASIC Inc. Hot IPs

Breaking News

Most Popular (Updated Daily)

RESEARCH TRIANGLE PARK, N.C.--June 30, 2006--ViASIC, Inc., the leading provider of standard-metal technologies, today announced DuoMask, a high-density, high performance two-layer standard-metal fabric for building configurable SOC's. With DuoMask, designers can easily and quickly use configurable logic to add or change SOC features, fix even minor bugs, and design different versions of the same system for different markets.

For seven metal processes DuoMask uses via layers 2 and 4 to program the pre-built and pre-characterized logic and routing. The configurable logic is built upon existing technologies providing an accurate, proven fabric almost immediately for any process. The new configurable logic libraries require no logic cell layout, timing or power characterization; instead they rely on dependable, proven existing libraries. DuoMask is the densest standard-metal fabric available with 150 gates per mm2 at 90nm.

"DuoMask provides affordable two mask customization for every digital process," said Bill Cox, CTO, ViASIC. "We are excited to provide this new technology which supports virtually anyone, in any process, at any fab and best of all it relies on existing proven and characterized libraries."

Configurable fabrics are one method that SoC designers can leverage their IP with low-cost, low-risk respins that empower customization of existing designs and rapid, easy addition of new features, expanding available markets for this IP. Configurable SoC's use standard-cell flows to build the majority of the chip. Implementing the proven, stable blocks with classic methodologies, only a portion of the chip is built with a configurable fabric. This configurable portion of the SoC can then be used to implement a variety of functions that could be subject to change. With SoC configurability, designers can now get initial versions of a product out before final specs are set, getting hot products to market first.

DuoMask, along with ViASIC's one-mask library ViaMask, and ViaPath, a place and route tool for standard-metal, will be demonstrated at the Design Automation Conference in San Francisco on July 24 at booth 1108. To set up a private suite appointment email dac@viasic.com. For more information on the conference visit www.dac.com.

Price and Availability

DuoMask is immediately available for all digital processes between .35 micron and .45 nanometers. U.S. pricing starts at $95,000.

About ViASIC

ViASIC is a privately held EDA company and the leading provider of standard-metal tools and methodologies. The company's patented ViaMask fabric is a complete library for building platform ASICs or embedding single via layer configurable sections into a system on a chip (SoC). DuoMask is two vias layer configurable fabric built upon existing technologies. ViASIC also offers ViaPath, a robust physical design solution for via-configurable fabrics. ViASIC is located at 6015 Fayetteville Road Suite 214 , Durham, NC 27713. Telephone 919-405-1345, www.viasic.com




   

Contact ViASIC Inc.

Fill out this form for contacting a ViASIC Inc. representative.

Your Name:
Your E-mail address:
Your Company address:
Your Phone Number:
Write your message:
   

 



E-mail This Article Printer-Friendly Page



list: -1219966760.83 seconds
detail: 0.00113296508789 seconds
prov: 0.00195002555847 seconds
end_new