Details of ST's Nomadik processor disclosed
(07/26/2006 8:42 PM EDT)
SAN FRANCISCO — An STMicroelectronics executive provided a glimpse of its future Nomadik multimedia processor platform consisting of multiple CPUs, DSPs and subsystems on a single chip.
Speaking at the Design Automation Conference here, Pierre Paulin, director of SoC platform automation at ST's central R&D, said it is integrating "a reconfigurable array of DSP cores"—as many as six—and "multicore CPUs" into a Nomadik processor slated for production in 2008 using 45-nm process technology. Though not a member of ST's Nomadik team, Paulin provides CAD tool support for the team. "They are my customer," he explained.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Exec details ST's ARM Cortex-A9 licensing choice for HDTVs
- Boston Circuits Unveils Details of the gCORE16 Multicore Processor; Revolutionary new ''Grid on Chip'' architecture delivers PC level performance and flexibility at embedded level cost, power, size
- STMicroelectronics' Award-Winning Nomadik Processor Family Ushers in Video for Next-Generation Handsets
- STMicro won't use ARM's 3-D core in Nomadik processor
- Achronix FPGAs Add Support for Bluespec's Linux-capable RISC-V Soft Processors to Enable Scalable Processing
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024