Denali CTO: Formalize contract between hardware, software
(09/12/2006 5:37 PM EDT)
SANTA CLARA, Calif. — The semiconductor industry needs to revisit and redefine traditional boundaries between hardware and software, according to Mark Gogolewski, chief technology officer at intellectual property (IP) and EDA vendor Denali Software Inc.
Delivering the keynote address kicking off Denali's MemCon here Tuesday (Sept. 12), Gogolewski called for the industry to formalize the contract between hardware and software. This contract, he said, is represented by control registers, which represent the largest portion of a hardware functional specification or programmers guide.
"The registers go through constant change from the beginning of chip [design] to the end," Gogolewski said.
Paraphrasing an address given by Gary Smith, Gartner Dataquest's chief EDA analyst at the recent Design Automation Conference (DAC), said chip design costs have stayed relatively flat since 1997, but that overall IC development costs have grown considerably. Gogolewski, as Smith did, pointed to the cost of software development as the culprit.
E-mail This Article | Printer-Friendly Page |
Related News
- New Integration Between SpaceStudio Hardware Software Co-design and European Space Agency’s TASTE Tool Set
- Is Software and Hardware Ready for TinyML Tsunami?
- OpenHW Group Announces Tape Out of RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software
- Renesas Launches Integrated Development Environment That Enables ECU-Level Automotive Software Development Without Hardware
- OpenHW Group Announces RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process