Rambus CEO: Consumer arena now drives IC demand
(12/05/2006 3:58 PM EST)
BENGALURU, India — Consumer electronics now drives chip demand, Rambus Inc.'s top executive says, and it's proving to be the most demanding customer of all.
Speaking on the "IP Model for Next-Generation Design Platforms," Rambus president and CEO Harold Hughes said the consumer electronics segment is the most demanding in part because the architectures of mobile electronic systems is very different from the plug-and-play systems working on electric power.
It's a different model from the 1980s, when government organizations drove semiconductor demand, and the 1990 to 2005 period, when business needs dictated chip consumption, he said, adding that the intellectual property business is seeing a similar change of scene.
"This difference throws up different needs on the semiconductor players, and the need for specialist semiconductors is growing," he said. Of the $300 billion chip market in 2008, semiconductor R & D is worth between $50 billion and $60 billion, opening opportunities for companies like Rambus (Los Altos, Calif.).
E-mail This Article | Printer-Friendly Page |
|
Related News
- Top Ten IC Design Houses Ride Wave of Seasonal Consumer Demand and Continued AI Boom to See 17.8% Increase in Quarterly Revenue in 3Q23, Says TrendForce
- Global Top Ten IC Design Houses Break Even in Q1, Hope for Recovery in Q2 Bolstered by AI Demand, Says TrendForce
- Exclusive CEO Interview: Latest Funding Drives Ventana's First RISC-V Chiplets in Data Centers
- The Real Reason Behind the Automotive Industry IC Shortage - A Step-Function Surge in Demand!
- Revenue of Top 10 IC Design (Fabless) Companies for 2020 Undergoes 26.4% Increase YoY Due to High Demand for Notebooks and Networking Products, Says TrendForce
Breaking News
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- TSMC Reports First Quarter EPS of NT$8.70
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance