NEC shuts fabs, exits structured ASICs
(02/22/2007 1:10 PM EST)
TOKYO — Coping with a ''crisis'' amid losses in its business, troubled NEC Electronics Corp. Thursday (Feb. 22) announced a three-year restructuring plan that included the exit from the structured ASIC and single-chip cell phone sectors. The company, which is also terminating 600 engineers, will consolidate its nine front-end manufacturing lines in Japan to four.
E-mail This Article | Printer-Friendly Page |
|
Related News
- NEC Electronics Introduces the CMOS-12M Series of Mainstream Structured ASICs
- Synplicity and NEC Electronics Ink Physical Synthesis OEM Agreement for ISSP Structured ASICS
- U.S. Paves Roads to Trusted Fabs
- eASIC Integrates Front-End from Interra to Accelerate Deployment of Nextreme Structured ASICs
- eASIC and Avnet ASIC Israel (AAI) Partner to Support Increasing Demand for Structured ASICs in Israel
Breaking News
- Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management
- Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain
- Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances
- M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
Most Popular
- Rivos Raises More Than $250M Targeting Data Analytics and Generative AI Markets
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
- Microchip Technology Acquires Neuronix AI Labs