1-112Gbps Medium Reach (MR) and Very Short Reach (VSR) SerDes
QUALCOMM Begins Utilizing 45 Nanometer Semiconductor Process Technology
“QUALCOMM's synergistic relationship with strategic foundry partners continues to support our long history of technology innovation as we reach this milestone in leading-edge process technology,” said Behrooz Abdi, senior vice president and general manager for QUALCOMM CDMA Technologies. “We look forward to enabling new classes of products at 45 nanometers and beyond, which will evolve the role of wireless in everyday life to a new level for people around the world.”
QUALCOMM has taped out its product on a low power-optimized 45 nm process that utilizes advanced immersion lithography and very low k inter-metal dielectrics features. The technology provides competitive performance with significant cost efficiency, along with improved performance on leakage and integration. The Company has also begun development work on 40 nm process technology, which is expected to deliver even greater benefits in semiconductor performance, cost and efficiency.
Close collaboration with strategic technology and foundry partners is a key part of QUALCOMM's Integrated Fabless Manufacturing (IFM) business model, which delivers greater efficiencies and accelerated technology advancement to the industry.
QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2007 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
|
Related News
- Samsung Announces Industry-First 45 nanometer Embedded Flash Logic Process Development
- Samsung and Intrinsity Jointly Develop the World's Fastest ARM Cortex-A8 Processor Based Mobile Core in 45 Nanometer Low Power Process
- Synopsys IC Compiler Routing Qualifies for TSMC's 45-Nanometer Process
- Texas Instruments new process techniques solve low-power challenges in delivering company's first 45 nanometer wireless device
- Synopsys Selected to Develop 45-Nanometer USB PHY IP for IBM Foundry Process
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |