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USB V3.1 Power Delivery Type-C Port Evaluation board for OTI9108 IP
Sonics files for IPO
Peter Clarke, EE Times
(08/27/2007 10:42 AM EDT)
LONDON -- Sonics Inc. (Mountain View, Calif.) has filed forms with the Securities & Exchange Commission for an initial public offering of common stock.
Sonics provides interconnect intellectual property and EDA tools to configure it for use joining blocks together on system chips. According to one report Sonics is looking to raise $80 million in the IPO.
(08/27/2007 10:42 AM EDT)
LONDON -- Sonics Inc. (Mountain View, Calif.) has filed forms with the Securities & Exchange Commission for an initial public offering of common stock.
Sonics provides interconnect intellectual property and EDA tools to configure it for use joining blocks together on system chips. According to one report Sonics is looking to raise $80 million in the IPO.
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