Actel Delivers Industry's First 4x4 mm Package For Programmable Logic Devices
Portable Applications Benefit from Industry's Lowest Power IGLOO FPGAs in Smallest Footprint
MOUNTAIN VIEW, Calif., November 13, 2007 — Achieving a significant milestone for the industry, Actel Corporation today announced it is offering its low-power 5µW (microwatt) IGLOO field-programmable gate arrays (FPGAs) in a 4-millimeter (mm) package with a 0.4-mm ball pitch, the smallest package for any programmable logic device on the market. Complementing its existing portfolio of small 8x8 mm and 5x5 mm packages , the Actel device in the new package offers designers four times the density, three times the I/O and a 36 percent reduction in size compared to competitive programmable logic devices. Smaller than a kernel of corn, the new IGLOO FPGAs are an ideal solution for power-sensitive, space-constrained handheld devices such as smart phones, portable media players, secure mobile communications devices, remote sensors, security cameras and portable medical devices.
"Today, designers require ultra low-power devices in small packaging, power-optimized design tools, and complementary IP solutions to create a successful portable application. Actel continues to break new ground and set new standards for the PLD industry as it addresses these areas," said John East, president and CEO at Actel Corporation. "As we move forward, Actel will continue to address the unique challenges facing portable designers, particularly relating to power efficiency and the complementary technologies required to manage power. We intend that when power matters, designers think Actel."
The first device to be offered in the 4x4 package will be the 30,000-gate IGLOO AGL030 device. The IGLOO FPGA delivers a staggering 200x less static power and more than 10x the battery life than competitive offerings. Actel also offers the feature-rich IGLOO family in pin-compatible 8x8 mm and 5x5 mm packages, enabling migration between packages. The 4x4mm devices feature on-board flash memory, 66 user I/Os and over 192 equivalent macrocells. IGLOO supports unique low-power states, such as Actel’s innovative Flash*Freeze mode, which stops the clocks, puts the I/Os into a know state and reduces power dramatically while preserving the state of SRAM and registers. IGLOO devices enter and exit Flash*Freeze mode within 1µs under the control of a single pin, allowing for dramatic system power savings to be quickly and easily achieved.
Pricing and Availability
The IGLOO AGL030 device in a 4x4 mm package will sample in December, with mass production slated for Q1 2008. Pricing will start at $1.50 in volume quantities.
About Actel
Attacking power consumption from both the chip and the system levels, Actel Corporation’s innovative FPGAs and programmable system chip solutions enable power-efficient design. The company is traded on the NASDAQ National Market under the symbol ACTL and is headquartered at 2061 Stierlin Court, Mountain View, Calif., 94043-4655. For more information about Actel, visit http://www.actel.com.
|
Microsemi Hot IP
Related News
- Menta Delivers Industry's Highest Performing Embedded Programmable Logic IP for SoCs
- Lattice Announces New 32 QFN Package For MachXO2 Programmable Logic Devices
- MorethanIP releases the industry's first Ethernet L2 Switch Engine for Programmable Logic Devices and structured ASIC
- Precision RTL Synthesis Tool from Mentor Graphics Delivers Excellent QoR for Designs Using Actel's ProASIC Plus Devices
- Actel's Advanced Packaging Technology Delivers High-Density, Programmable Alternative to Known Good Die
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |