Dolphin Integration launches a 32-bit processor, the densest core for SoC embedded Control Applications including Power Management
“On the one hand, our platform strategy enables a smooth upward migration from 8051 and 80251, while on the other hand our Memory and Standard Cell offering ensure higher performances, comments Pauline Buttin, microcontroller marketing manager, as the Development platform PRIDE™ facilitates application retargeting with a significant gain of silicon area”.
The upgrade of BIRD™, the Built-In-Real-time Debugger, one of our well-known development solutions, shall released incessantly to provide with the most effective solution for application-rich SoC developments.
FlipAPS32-051H is licensed jointly by CORTUS and DOLPHIN Integration.
More information, please contact logic@dolphin.fr
|
Dolphin Design Hot IP
Related News
- Brand new 32-bit RISC core: XAP3 ASIC processor liberates embedded systems industry with very high code density, low power and software flexibility
- picoTurbo Announces pT-120 Portable Low-power 32-bit Processor Core for High-performance SOC Designs
- DOLPHIN Integration launches the 32-bit challenger: FlipAPS-32, a processor tiny enough for embedding controls
- Toshiba Launches New 32-Bit Microcontroller With ARM926EJ-S Processor
- CAST Energizes Small, Fast Systems with New Low-Power, 32-Bit Processor Cores
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
- Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |