Camera SLVS-EC v.2.0 5.0Gbps / MIPI D-PHY v2-1 4.5Gbps combo Receiver 4-Lane
Leader in the Mobile Digital Television Chip Market Signs Multiuse License Agreement for Configurable ARC Solutions
MOBILE WORLD CONGRESS, BARCELONA, Spain, February 13, 2008 – ARC International (LSE: ARK) today announced that a leading chip supplier in the mobile multimedia broadcasting market has signed a new multiuse license agreement for configurable ARC processors. The customer’s series of ARC-Based™ system-on-chip (SoC) devices will be leveraging ARC’s configurable core and DSP technologies while aiming to achieve high-quality, multi-standard, digital TV reception in nearly every global geographic region. This is part of a series of ARC customer announcements made today that focuses on the high-growth Mobile TV market, which is expected to reach 140 million Mobile TV subscribers by 2011 according to industry analysts. See related announcements dated February 13, 2008 for more information.
This customer will be leveraging a unique hybrid of advanced XY DSP functionality with one of ARC’s most power efficient 32-bit RISC cores. The combination provides ease of integration as well as significantly lower power consumption than separate RISC and DSP cores. Low power modes integral to the ARC core will ensure meeting even lower power target needed for mobile multimedia devices, thereby providing consumers longer viewing times on a single battery charge.
“The three announcements today from customers targeting the Mobile TV market reflects ARC’s strategy of enabling customers to deliver an enhanced user experience to consumers in high volume applications,” said Bill Jackson, vice president of marketing at ARC. “Along with segments such as WiFi, WiMAX, portable media players, and Flash memory, Mobile TV represents one of the most promising markets from a unit volume perspective as consumers continue to drive OEMs for devices that allow them to play multimedia content anytime, anywhere.”
The Configurable ARC® 600 Core Family
The configurable ARC 600 processor core family with ARC's XY Advanced DSP Subsystem delivers the most power- and area-efficient 32-bit CPU and DSP combination in its performance class in a unified RISC architecture. Furthermore, the designer can create custom instructions and IP blocks to further customize the chip. For example, configuring a CPU to his unique application allows the designer to remove unneeded functionality to reduce die size and power consumption.
About ARC International plc
ARC International is the world leader in configurable multimedia subsystems and CPU/DSP processors. Used by over 140 companies worldwide, ARC's configurable solutions enable the creation of highly differentiated system-on-chips (SoCs) that ship in hundreds of millions of devices annually. ARC’s patented subsystems and cores are smaller, consume less power, and are less expensive to manufacture than competing products.
ARC International maintains a worldwide presence with corporate and research and development offices in California and St. Albans, UK. For more information visit www.ARC.com. ARC International is listed on the London Stock Exchange as ARC International plc (LSE: ARK).
|
Related News
- Siano Mobile Silicon Targets Mobile Digital TV Market Using ARC's Configurable Processor Technology
- Rambus Signs License Agreement with Western Digital
- RDA Microelectronics Signs Digital TV IP License and Development Agreement With Trident Microsystems
- InterDigital Signs SII Mobile Communications to Worldwide Patent License Agreement
- InterDigital Signs Casio Hitachi Mobile Communications to Worldwide 2G and 3G Patent License Agreement
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |