Camera SLVS-EC v.2.0 5.0Gbps / MIPI D-PHY v2-1 4.5Gbps combo Receiver 4-Lane
TSMC wants more of IC pie
(04/27/2008 8:15 PM EDT)
SAN JOSE, Calif. — Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) has unveiled a new and possibly controversial strategy that involves more collaboration in the early stages of the IC design process.
TSMC's program is aimed to reduce development cycles and manufacturing costs, according to analysts. But it could also possibly cause a major stir in the industry, as the silicon foundry giant wants more of the IC pie and appears to be encroaching on the turf in the third-party EDA, IP, packaging and test communities.
As part of its strategy, TSMC (Hsinchu, Taiwan) is quietly pushing a concept called the Open Innovation Platform (OIP), according to Gartner Inc. During its technology conference last week, TSMC also disclosed details about its roadmap in the chip-packaging front, including its internal efforts in the three-dimensional (3D) arena.
OIP is a program that involves more "collaboration between the foundry and its clients at the early stages of the design phase," said Jim Walker, an analyst with Gartner (Stamford, Conn.), in an e-mail newsletter.
E-mail This Article | Printer-Friendly Page |
|
Related News
- TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
- proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem
- The Importance of 3D IC Ecosystem Collaboration
- Memory Market Collapse to Lift TSMC to Top Spot in 3Q22 Ranking
- Siemens extends support of multiple IC design solutions for TSMC's latest processes
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process