Xilinx Completes Functional Reorganization
SAN JOSE, Calif. -- June 4, 2008 -- Xilinx, Inc. announced a corporate reorganization into functional areas to better serve its customers and improve its operating performance. As a result of the reorganization, Xilinx will eliminate approximately 250 positions, or about 7 percent of the Company's global workforce. The workforce reduction is expected to be completed by the end of the next fiscal quarter.
The Company expects to record restructuring-related charges of approximately $18-22 million in connection with the reorganization. These one-time pre-tax charges are comprised of approximately $16-19 million of severance pay expenses, which will be recorded in the first quarter of fiscal 2009 and approximately $2-3 million of facility and other associated costs, a portion of which will be recorded in the second quarter of fiscal 2009.
The restructuring charges will adversely impact the Company's first quarter's operating expenses, which were forecasted to be approximately flat sequentially for the June ending quarter. The Company will report its fiscal first quarter results after market close on July 16, 2008. A real-time audio broadcast of the teleconference will be provided at http://www.investor.xilinx.com.
About Xilinx
Xilinx, Inc. (NASDAQ: XLNX) is the worldwide leader of programmable logic solutions. Additional information about Xilinx is available at http://www.xilinx.com.
|
Xilinx, Inc. Hot IP
Related News
- AMD Completes Acquisition of Xilinx
- Xilinx Extends Functional Safety into AI-class Devices
- Xilinx Single-Chip Solution with On-Chip Redundancy for Functional Safety Speeds Up IEC 61508 Certification and Reduces Systems Development Cost
- Xilinx's DDR4 Memory Solution for UltraScale Devices Completes Agilent N6462A Compliance Test Running at 2400 Mb/s
- Xilinx's Comprehensive Functional Safety Design Package Enables Smarter Factories and Medical Equipment
Breaking News
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
- Rambus Advances AI 2.0 with GDDR7 Memory Controller IP
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |