Tensilica Hires Jerry Ardizzone as Vice President Worldwide Sales
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
SANTA CLARA, Calif.-- Aug. 11, 2008 -- Tensilica,® Inc. today announced that Jerry Ardizzone has joined the company as vice president of worldwide sales. He brings over 24 years of semiconductor and semiconductor IP (intellectual property) sales management experience.
"Over 130 companies design with Tensilica's processor cores, including half of the top 10 semiconductor companies in the world," Ardizzone said. "Tensilica"™s processor cores are proven in everything ranging from millions of cellular phones to the world"™s largest router. The opportunities for growth are tremendous."
"We are excited to get Jerry at this time in our company's growth," stated Jack Guedj, Tensilica's president and CEO. "Jerry has the leadership skills we need to accelerate our growth trajectory both in customizable applications processors and standard audio, video and baseband signal processing IPs."
Ardizzone spent 14 years at Motorola Semiconductor, where he managed the global sales team for the consumer market. He spent seven years at ARM in various roles including executive vice president of worldwide sales, and president of ARM, Inc., the US operations for ARM, Ltd. He also worked for several other semiconductor IP companies including Innovative Silicon, Inc. and IPextreme. Ardizzone holds a B.S. in Electrical Engineering degree.
About Tensilica
Tensilica, Inc., is the recognized leader in customizable applications processors, DSPs and standard IP cores for audio, video, imaging, security, networking, and baseband signal processing. The automated design tools behind all of Tensilica"™s customizable applications processor cores powers top tier semiconductor companies, innovative start-ups, and system OEMs for high-volume products including mobile phones, consumer electronics devices (including portable media players, digital TV, and broadband set top boxes), computers, and storage, networking and communications equipment. For more information on Tensilica's patented, benchmark-proven processors, visit www.tensilica.com.
|
Related News
- Codasip Welcomes Jerry Ardizzone to Executive Team as Vice President of Worldwide Sales
- Breker Verification Systems Appoints Andy Stein Vice President of Worldwide Sales as Company Scales New Business Opportunities
- BrainChip Inc Appoints Vice President of Worldwide Sales
- Uniquify Appoints Dale Olstinske Senior Vice President of Worldwide Sales
- oViCs names Jess Herrera as Vice President of Worldwide Sales & Marketing
Breaking News
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- TSMC Reports First Quarter EPS of NT$8.70
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance
E-mail This Article | Printer-Friendly Page |