Universal Chiplet Interconnect Express (UCIe 1.0) Controller
Aspec Technology Plans Sale of System IP Business
Aspec Technology Plans Sale of System IP Business
SUNNYVALE, Calif.----Dec. 9, 1999--Aspec Technology, Inc. (Nasdaq:ASPC), a provider of advanced software solutions, which dramatically increase design productivity, announced plans to sell its System Intellectual Property (IP) business. This includes Aspec's traditional library business unit and Ascent Design Corporation, the design services business unit. P. ``The sale of the System IP business allows the Company to concentrate its full energy on its new strategic direction of providing advanced software solutions. Our software solutions increase design productivity through Silicon Intelligent(TM) Electronic Design Automation (EDA) tools and the automation and management of the actual design and product process from initial product development to end of life,'' stated Mike Carroll, president and CEO of Aspec. ``We have a great deal of talent and IP in our System IP business, which represents a significant value to the right company. We have generated considerable interest from potential purchasers and have active discussions underway. We hope to have a sale concluded during our first fiscal quarter.''
About Aspec Technology
Aspec Technology, Inc. (Nasdaq:ASPC) is a provider of advanced software solutions, which dramatically increase design productivity. Aspec's Silicon Intelligent(TM) Electronic Design Automation (EDA) tools address key deep submicron design and verification problems for complex Integrated Circuits (IC) and systems. Aspec's Inbox Software provides Internet-based, business-to-business, content management software solutions, which shorten time-to-market by managing product content and the business processes required to deliver and maintain content throughout the product lifecycle -- from concept to end-of-life. Aspec is located at 830 East Arques Avenue, Sunnyvale, CA 94086. More information is available at www.aspec.com.
This news release contains forward-looking statements related to Aspec which are based on current expectations that includes statements regarding the Company's future expectations, beliefs, hopes, intentions and strategies. These forward-looking statements may involve substantial risks and uncertainties. Actual results and developments therefore may differ materially from hose described in this release. For more information about Aspec and risks arising when investing in Aspec, you are directed to Aspec's most recent reports on Form 10-Q and registration statement on Form S-1 as filed with the United States Securities and Exchange Commission.
Contact:
Aspec Technology
Douglas Klint, 408/774-2199
dklint@aspec.com
or
Media Contact
Shelton Communications Group
Katie Olivier, 972/239-5119
kolivier@sheltongroup.com
Related News
- Aspec Technology Announces The Signing of a Definitive Agreement to Sell Its System IP Business
- Verimatrix Completes Sale of its Silicon IP Business Unit to Rambus
- Intel Completes Sale of Smartphone Modem Business to Apple
- Arteris IP FlexNoC Interconnect Licensed by Samsung's System LSI Business for Digital TV Chips
- Foresight announces sale of IoT technology business Simulity Labs Limited to ARM
Breaking News
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
E-mail This Article | Printer-Friendly Page |