eSilicon CEO sees new ASIC landscape
(02/08/2009 6:55 PM EST)
SUNNYVALE, Calif. -- The current IC downturn has already taken its toll on the semiconductor industry in 2009.
And it's only February. Most--if not all--chip makers are bracing for tough economic conditions for the remainder of this year and perhaps beyond.
One semiconductor and EDA veteran sees a ray of hope. Just think positive, said Jack Harding, president, chief executive and chairman of eSilicon Corp. (Sunnyvale, Calif.), a fabless ASIC vendor.
''I've never been a doomsdayer,'' Harding said at the company's headquarters here. ''We'll get through it.''
There is still plenty of IC design activity going on despite market conditions. And surprisingly, there is even movement at the bleeding-edge of design. ''Right now, we're shipping 65-nm,'' he said. ''We're designing 40-nm. We're even getting quotes for 28-nm.''
Despite his upbeat sentiments, Harding also disclosed some sobering news about ASICs and the IC market as a whole. "The ASIC business will become fabless one day, with one or two exceptions,'' he said.
The ''two exceptions'' to the rule could end up being Korea's Samsung Electronics Co. Ltd. and Japan's Toshiba Corp., he said. Both vendors will continue to own fabs.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Fabless ASIC startup eSilicon raises $6 million in funding
- Intel signs 7 out of top 10 fabless companies, sees 18A test chip
- eSilicon Announces Production Qualification of 5G Infrastructure ASIC
- eSilicon Tapes Out 7nm 400G Gearbox/Retimer Test ASIC
- eSilicon builds momentum as a strong tier one FinFET ASIC supplier
Breaking News
- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
- Rambus Advances AI 2.0 with GDDR7 Memory Controller IP
- Faraday Reports First Quarter 2024 Results
- RAAAM Memory Technologies Closes $4M Seed Round to Commercialize Super Cost Effective On-Chip Memory Solutions
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows