RAD3 Communications Announces Wireless Communications IP Library
Calgary, Canada – February 17, 2009 – RAD3 Communications Inc. (RAD3), a leading communications intellectual property (IP) company, today announced the commercial availability of its wireless communications IP library. RAD3’s extensive library of IP is targeted to wireless infrastructure vendors, semiconductor companies and communication OEM’s.
RAD3’s wireless solutions consist of:
-
Software Defined Radio and ASIC/FPGA modules targeted to WiMax and LTE (late Q2 availability)
-
Forward Error Correction modules targeting multiple wireless standards including WiMax, WiFi, LTE and Wireless USB
-
Industry leading, silicon proven, FFT/IFFT modules providing a best-in-class solution for all types of OFDM modems and other applications requiring high-speed FFT processing.
The majority of the IP is silicon proven and in production in numerous communication products world-wide.
“The commercial availability of our wireless IP is an important milestone for RAD3.” said Roger Bertschmann, President RAD3. “Our wireless IP library provides a robust and highly-verified platform for communications companies to base their products on. We plan to add a significant number of new products to the library in the course of the year and are also excited by the upcoming release of our LTE software defined radio solution.”
About RAD3 Communications Inc.
RAD3 is a leading supplier of communications intellectual property (IP) for new and emerging wired and wireless communication standards. RAD3’s extensive library of IP solutions enables communication companies to rapidly design and build their products using a suite of industry proven and tested IP. For more information, please visit the RAD3 web site: www.rad3comm.com.
|
Related News
- Cyient to Acquire Portugal-Based Celfinet to Strengthen its Wireless Communications Offerings
- Successful Transmission of High-Quality, Ultra-Low-Latency Video over 60 GHz Wireless Communications System
- IQ-Analog Adopts Diakopto's ParagonX Platform for Next-Generation 5G Wireless Communications ICs
- Synopsys Launches New ARC Communications IP Subsystem for Wireless Narrowband IoT Designs
- Imagination introduces industry's most comprehensive GNSS IP core as part of its Ensigma wireless communications portfolio
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
- Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |