Sonics Marks Licensee Milestone with Total Shipments Surpassing 500 Million Units
MILPITAS, Calif., – March 10, 2009 – Sonics, Inc., a premier supplier of system-on-chip SMART Interconnect™ solutions, has announced that the company’s cumulative licensee shipments surpassed the 500 million unit mark at the end of 2008. For more than a decade, Sonics has been shipping its solutions to leading semiconductor companies including Texas Instruments, Broadcom Corp., Samsung and Toshiba. Today, as more companies embrace SoC design and incorporate multiple intellectual property (IP) blocks on-chip, Sonics remains poised for continued growth in the digital entertainment, wireless and mobile markets.
As a result of its success over the last 12 years, Grant Pierce, Sonics CEO, has been invited to participate in the Semico Summit 2009 in Scottsdale, Ariz. He will be part of a March 10 panel hosted by Mentor Graphics’ Chairman and CEO, Walden Rhines, entitled: “What are the Attributes of a Successful Company?” Pierce will share his insights on rules for customer engagement in the new global economy, as well as strategic success factors for semiconductor companies competing in a disruptive and dynamic market.
”Sonics’ success with many of the world’s top semiconductor suppliers has been achieved by delivering three generations of proven silicon solutions that address critical on-chip interconnect issues and leveraging their unique platform strategies,” said Pierce. “This success has not gone unnoticed as we continue to partner with new semiconductor leaders worldwide who remain focused on design innovation and maintaining global prominence across the digital consumer, wireless and mobile markets.”
Sonics provides SoC designers with the largest portfolio of on-chip connectivity solutions uniquely designed to optimize memory access, seamlessly manage network traffic and increase system performance. Its solutions enable designers to quickly mix and match various IP blocks without concern for individual IP implementations by abstracting information such as bus width, protocol and eliminating complexities in the interconnect. In turn, this enables right-by-design methodologies starting at SystemC architecture models that match the RTL and verification test benches used for final timing closure at tape out.
About Sonics
Sonics, Inc. provides SoC designers with critical semiconductor IP that is uniquely designed to optimize memory access and increase SoC performance in advanced digital consumer, wireless and mobile devices. Sonics' customers see the benefits of high design predictability and increased design efficiency. The company's broad array of on-chip connectivity solutions address the growing complexity found in consumer devices with advanced voice, data and video features. Major semiconductor and systems companies, including Broadcom, Samsung, Texas Instruments and Toshiba, leverage Sonics' technology in leading products in the wireless, digital multimedia and communications markets. For more information please visit www.sonicsinc.com.
|
Related News
- Estimated Shipments of iPhone 14 Devices in 2022 Have Been Lowered to 78.1 Million Units Due to Impact of COVID-19 Lockdown on Foxconn's Base in Zhengzhou, Says TrendForce
- Worldwide Smartphone Shipments Edge Past 300 Million Units in the Second Quarter; Android and iOS Devices Account for 96% of the Global Market, According to IDC
- Sonics Licensees Shipments Surpass Two Billion Units
- Shipments of total OpenGL ES enabled GPUs to hit 1 billion units per year by 2014, says Imagination
- XDR(TM) DRAM Passes 50 Million Units Shipped Milestone
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |