Camera SLVS-EC v.2.0 5.0Gbps / MIPI D-PHY v2-1 4.5Gbps combo Receiver 4-Lane
Memory interface IP sector heats up
(06/24/2009 12:07 AM EDT)
SANTA CLARA, Calif. -- The current and ongoing downturn has taken a major toll on the semiconductor industry.
But one of the few exceptions to the rule is the semiconductor intellectual-property (IP) business--at least on some fronts. The memory interface IP sector, especially for DRAM, is heating up.
ARM, Denali, Synopsys, Virage and other memory interface IP vendors are now seeing an upswing in business, analysts said. The severe downturn is causing a growing number of OEMs to evaluate or rationalize their internal IP efforts, said Mark Gogolewski, chief technology officer of IP provider Denali Software Inc. (Sunnyvale, Calif.).
The cost of IP development is becoming expensive for OEMs. ''The investments for DRAM interface development have gone up,'' Gogolewski said.
E-mail This Article | Printer-Friendly Page |
Related News
- Virage Logic Expands Memory Interface Product Portfolio With New DDR3 Solution That Supports Speeds Up to 1.6 Gb/s
- EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices
- JEDEC Updates Universal Flash Storage (UFS) and Supporting Memory Interface Standard
- Rambus Expands Portfolio of DDR5 Memory Interface Chips for Data Centers and PCs
- AMD Acquisition of Xilinx Heats Up Competition with Intel
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results