TSMC keynoter touts cooperative business models
(07/29/2009 2:51 AM EDT)
SAN FRANCISCO -- Future growth in EDA and other segments of the semiconductor industry supply chain depends on the evolution of a new breed of collaborative business model that enable partners to pool costs and increase profits, according to Fu-Chieh Hsu, vice president of Design & Technology Platform at leading foundry Taiwan Semiconductor Manufacturing Co. (TSMC).
Delivering a keynote address at the Design Automation Conference here Tuesday (July 28), Hsu said a community business model with tight partnerships could enable TSMC and ecosystem partners to collectively create greater value and get better returns by collaborating to reduce waste, development costs and maintenance overhead.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum
- Agile Analog joins TSMC Open Innovation Platform IP Alliance Program
- SiFive Awarded TSMC Open Innovation Platform Partner of the Year
- Analog Bits to Demonstrate Pinless PLL and Sensor IP in TSMC N4 and N5 Processes at TSMC 2022 North America Open Innovation Platform® Ecosystem Forum
- Intrinsic ID Presents Full Range of Chip Security Solutions at TSMC 2022 Open Innovation Platform® Ecosystem Forum
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process