Samsung Licenses MOSAID Wireless Patents
OTTAWA, ONTARIO-- Marketwire -- Nov. 23, 2009 -- MOSAID Technologies Inc. (TSX:MSD) today announced that it has signed a worldwide non-exclusive wireless patent license agreement with Samsung Electronics Co., Ltd. The effective date of the term license agreement is November 15, 2009.
Under the terms of the patent portfolio license agreement, MOSAID has granted Samsung a license under its patents, covering products sold globally by Samsung's Digital Media and Communications Business, including Wi-Fi enabled mobile handsets, notebook and netbook computers, and other system-level communications products. All other terms and conditions are confidential.
"We are very pleased that Samsung, as a global leader in both the mobile phone and smart phone markets, has chosen to license our wireless patents," said John Lindgren, President and Chief Executive Officer, MOSAID. "Our success in reaching negotiated agreements with leading global companies demonstrates the strength, value and fundamental nature of our wireless patents. We anticipate continued success in licensing our wireless patents to the producers of a wide range of Wi-Fi enabled products and systems, including mobile devices, laptop computers, gaming consoles and wireless infrastructure products."
About MOSAID
MOSAID Technologies Inc. is one of the world's leading intellectual property companies. MOSAID develops semiconductor memory technology and licenses patented intellectual property in the areas of semiconductors and telecommunications systems. MOSAID counts many of the world's largest technology companies among its licensees. Founded in 1975, MOSAID is based in Ottawa, Ontario. For more information, visit www.mosaid.com.
|
Related News
Breaking News
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- TSMC Reports First Quarter EPS of NT$8.70
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance
E-mail This Article | Printer-Friendly Page |