Rambus licenses InfiniBand chip supplier
Rambus licenses InfiniBand chip supplier
By Semiconductor Business News
February 20, 2002 (4:58 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020220S0039
LOS ALTOS, Calif. -- In a move to expand its communications business, Rambus Inc. here today announced that it has licensed its serial link technology to Banderacom Inc., a supplier of chips for InfiniBand applications. Bandercom has license Rambus' RaSer serial link cell for use in its IBandit target channel adaptor (TCA) product line. The IBandit-TCA is a single chip solution for the InfiniBand market. Rambus' RaSer technology is a scalable architecture that addresses current and future serial link applications. Offered as an analog core for ASIC and ASSP designs, RaSer can be employed across a variety of different networking applications, such as backplanes, routers, switches, and other products. "The RaSer cell, with its point-to-point, full duplex signaling meets the physical layer requirements for an InfiniBand link, and supports data rates well beyond the InfiniBand's [2.3-gigabits-per-second] link specification," said Terry Hulett , vice president of engineering for Banderacom of Austin, Texas.
Related News
- Rambus Licenses DPA Countermeasures to Utimaco
- Rambus Licenses its DPA Countermeasures to NVIDIA
- Boeing Licenses Rambus DPA Countermeasures to Protect Critical Aerospace and Defense Systems from Security Threats
- Rambus Cryptography Research Division Licenses Advanced Security Technologies to Altis Semiconductor
- LG Electronics (LGE) Licenses Rambus Cryptography Research's CryptoManager Security Platform
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |