1-112Gbps Medium Reach (MR) and Very Short Reach (VSR) SerDes
MOSAID Signs Wireless Patent License Agreement With Sony
OTTAWA, ONTARIO-- Feb. 1, 2010 - MOSAID Technologies Inc. (TSX:MSD) today announced that it has signed a worldwide, non-exclusive wireless patent license agreement with Sony Corporation of Japan.
Under the terms of the patent portfolio license agreement, MOSAID grants Sony a fixed-payment term license under MOSAID's wireless technology patents, covering all Sony Wi-Fi enabled products. The effective date of the term license agreement is January 1, 2010. All other terms and conditions of the license agreement are confidential.
"We are very pleased that Sony, a global leader in consumer electronics, has agreed to license our wireless patents," said Michael Vladescu, Vice President, Licensing and Intellectual Property, MOSAID. "We are now licensing our wireless patent portfolio into four markets - mobile handsets, notebook computers, gaming consoles and wireless infrastructure. MOSAID has signed 13 wireless patent license agreements, and we look forward to continued success in licensing our wireless patents into multiple markets."
About MOSAID
MOSAID Technologies Inc. is one of the world's leading intellectual property companies. MOSAID develops semiconductor memory technology and licenses patented intellectual property in the areas of semiconductors and telecommunications systems. MOSAID counts many of the world's largest technology companies among its licensees. Founded in 1975, MOSAID is based in Ottawa, Ontario. For more information, visit www.mosaid.com.
|
Related News
- MOSAID Signs Wireless Patent License Agreement With a Top-Ranked Semiconductor Supplier
- MOSAID Extends NXP's Patent License and Signs New Wireless Agreement; Provides update on Qimonda
- MOSAID Signs New Patent License Agreement With Nanya Technology
- MOSAID Enters Into Wireless Patent License Agreement With Sharp
- MOSAID Signs Patent License Agreement With Fabless Semiconductor Memory Company
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |