GSA Announces Infrastructure to Ease Third-Party IP Licensing Process for Semiconductor Industry
SAN JOSE, Calif. -- (July 12, 2010) – GSA, the voice of the global semiconductor industry, today announces its plans to help third-party IP buyers and sellers reduce costs and shorten the IP negotiation cycle with a new IP Licensing Best Practices survey and report.
GSA’s IP Interest Group formed an IP Licensing Working Group after responding to the industry’s need for a deliverable that will ease the third-party IP buying and selling process. The group’s first deliverable is a survey for companies to use as an objective measure of actual industry license practices and incorporate these practices, as appropriate, into current licensing activity.
“We’re excited that the working group was able to come together to create an infrastructure that provides IP buyers and suppliers valuable information about industry IP licensing norms,” said Warren Savage, president and chief executive officer of IPextreme, and chairman of GSA’s IP Interest Group. “We expect the information obtained in this quarterly report to become a valuable resource to the semiconductor industry for years to come.”
The IP Licensing Best Practices report is an on-going reflection of actual terms and conditions implemented by peers that buy and sell third-party IP for integration into systems-on-chip and covers three main areas:
- Warranty
- Indemnification
- Total Liability Limitation
The survey is currently open for all 2Q 2010 IP contract negotiations. All survey results will be confidential. Only participating companies will receive the aggregated and analyzed results. To participate in the survey, visit: www.gsaglobal.org/surveys/ip_licensing_best_practices/index.asp.
About GSA:
The Global Semiconductor Alliance (GSA) mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective fabless ecosystem through collaboration, integration and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 25 countries across the globe. www.gsaglobal.org
|
Related News
- Credo Launches 112G PAM4 SerDes IP for TSMC N3 Process Technology
- Saankhya Labs receives approval under Semiconductor Design Linked Incentive (DLI) scheme for Development of a System-on-Chip (SoC) for 5G Telecom infrastructure equipment
- Rambus Wins 2023 "Most Respected Emerging Public Semiconductor Company" Award from Global Semiconductor Alliance
- Pragmatic Semiconductor secures £182m ($231m) investment led by M&G and UK Infrastructure Bank
- Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC's Advanced 4nm RF FinFET Process
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |