First look inside iPhone 4 reveals high reuse
Rick Merritt, EETimes
6/24/2010 3:08 PM EDT
SAN JOSE, Calif.--You could call the new Apple iPhone 4 an iPad Nano because it uses at least seven chips from the popular Apple tablet, according to analysts from UBM TechInsights that have done a teardown of the new smartphone. STMicroelectronics won a coveted design win for its MEMS gyro in the handset.
The teardown specialist is preparing a full report on the iPhone 4. UBM TechInsights is a division of United Business Media, the publisher of EE Times.
Like the iPad, iPhone 4 uses Apple's A4 as its applications processor. However it uses a version with twice the memory—512 Mbytes of Samsung Mobile DDR SDRAM. Specifically the part uses the Samsung K4X4G643GB, a package-on-package stack of two 2 Gbit die.
E-mail This Article | Printer-Friendly Page |
Related News
- Augment your Peripheral slot's performance with the Low Power and High Throughput PCIe 4.0 PHY IP Cores in 12FFC with matching PCIe 4.0 Controller IP Cores
- Silex Inside releases a high throughput, scalable and performant MACsec engine
- iPhone X Costs Apple Nearly $370 in Materials, IHS Markit Teardown Reveals
- PLDA Announces XpressRICH4-AXI PCIe 4.0 IP, Providing a High Performance and Reliable AXI Bridge for SoC designs
- iPhone 7 Materials Costs Higher than Previous Versions, IHS Markit Teardown Reveals
Breaking News
- Synopsys Showcases EDA Performance and Next-Gen Capabilities with NVIDIA Accelerated Computing, Generative AI and Omniverse
- Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
- TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
- After TSMC fab in Japan, advanced packaging facility is next
- A System On Module (SoM) developed by Electra IC: BitFlex-SPB-A7 FPGA SoM
Most Popular
- After TSMC fab in Japan, advanced packaging facility is next
- HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
- Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure
- Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
- We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal