MILPITAS, Calif., October 11, 2010 Sonics, Inc.®, the worlds leading supplier of on-chip communications IP, today announced that it has joined TSMCs new Soft IP Alliance program. Sonics joins fellow industry leaders and Soft IP Alliance members including Atrenta, Chips&Media, Cadence Design Systems, MIPS Technologies, Inc. and Synopsys.
TSMCs Soft IP Alliance program enriches the companys IP alliance portfolio and encourages soft IP innovation and reuse through its Open Innovation Platform initiative. TSMC, along with its Soft IP Alliance partners, will collaborate to deliver power, performance and area optimizationan important consideration at advanced technology nodes.
We welcome Sonics as one of the key contributors to TSMCs Soft IP ecosystem, said Dan Kochpatcharin, deputy director, IP Portfolio Marketing at TSMC. Sonics advances in network-on-chip (NoC) technology, proven low-power expertise and memory Quality of Service (QoS) are valuable contributions to future SoC design innovations.
TSMC is expected to provide specific design documents and technology information through the program so that Sonics and other partners can optimize their soft IP to TSMCs technology. Sonics and Soft IP Alliance members will also expedite soft IP readiness by aligning their development with TSMCs process technology roadmap.
For nearly 15 years, Sonics has evolved its pioneering NoC technology to offer the broadest portfolio of intelligent on-chip communications networks and memory IP that form the foundation of todays highly advanced SoCs. The companys award-winning products optimize memory access, seamlessly manage on-chip network traffic, unify data flows and solve persistent network challenges in embedded systems while boosting system performance and reducing power consumption in complex, high-speed SoCs.
Were proud to be part of TSMCs industry-leading design and innovation initiatives that are propelling the future of SoC design, said Drew Wingard, founder and chief technology officer at Sonics. As the industry moves to more advanced process nodes and multi-die solutions, a comprehensive approach to system-level design and performance analysis is vital. Through this program, TSMC customers will ultimately gain access to a new level of soft IP innovation and reuse, as well as Sonics renowned performance, power and area advantages for advanced SoC design.
Sonics, Inc. is a pioneer of network-on-chip (NoC) technology and today offers SoC designers the largest portfolio of intelligent, on-chip communications solutions for home entertainment, wireless, networking and mobile devices. With a broad array of silicon-proven IP, Sonics helps designers eliminate memory bottlenecks associated with complex, high-speed SoC design, streamline and unify data flows and solve persistent network challenges in embedded systems with multiple cores. As the leading supplier of on-chip communications networks for the embedded market, Sonics has enabled its customers to ship more than 750 million units worldwide. Founded in 1996, Sonics is headquartered in Milpitas, Calif. with offices worldwide. For more information, please visit www.sonicsinc.com and www.sonicsinc.com/blog.