Qualcomm lists challenges in IC production
Mark LaPedus, EETimes
12/7/2010 6:51 PM EST
SAN FRANCISCO – During a keynote at the International Electron Device Meeting (IEDM) here, Jim Clifford, senior vice president and general manager of operations for Qualcomm Inc., reached for the panic button.
Clifford did not hit the panic button-yet. However, from a fabless perspective, he is worried about IC scaling, lithography and other issues in chip production. Fabless chip maker Qualcomm uses several foundries, such as Freescale, GlobalFoundries, SMIC, TSMC and UMC.
Qualcomm recently rolled out a new version of its Snapdragon chipset, based on a 28-nm process. The first foundry for the part is TSMC. Meanwhile, at IEDM, he outlined several challenges facing chip makers like Qualcomm in IC manufacturing. Here’s some of those challenges:
E-mail This Article | Printer-Friendly Page |
|
Related News
- China-Based IC Production to Represent 21.2% of China IC Market in 2026
- Wafer Capacity Forecast to Climb 8.7% As 10 New Fabs Enter Production
- New iPhone Models Become Key to Qualcomm's Top Spot in 3Q20 Revenue Ranking of Global Top 10 IC Design (Fabless) Companies, Says TrendForce
- Broadcom Overtakes Qualcomm for First Place While Nvidia Scores Highest YoY Growth in 2Q20 Revenue Ranking of Global Top Ten IC Design Companies, Says TrendForce
- Qualcomm Retakes Market Leadership in 1Q20 Revenue Ranking of Global Top 10 IC Design Companies, Says TrendForce
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
- Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024