Wolfson licenses Oxford Digital's TinyCore DSP
Edinburgh, UK -- January 5, 2011 – Wolfson Microelectronics plc, a global leader in the design and development of mixed-signal semiconductors and Audio Hubs that combine to deliver High Definition Audio solutions, has today announced a licence agreement with audio processing specialist Oxford Digital Limited to use its digital signal processor (DSP) core in a selection of Wolfson’s industry-leading Audio Hub products.
Oxford Digital’s TinyCore DSP core delivers a low-power, low gate count, highly configurable solution which simplifies the software development process, allowing easy porting of audio function algorithms thereby reducing the time-to-market for customers.
Wolfson’s architecture-defining Audio Hubs blend together many of Wolfson’s successful audio components to deliver world-class audio performance, significantly enhanced battery life, longer music playback time and more end user features at a lower total cost. Crucially, Wolfson’s Audio Hubs enable system designers to optimally manage increasingly complex multiple use cases in portable multimedia applications including smartphones, tablet computers, e-book readers, navigation devices and media players.
Eddie Sinnott, Portfolio Director at Wolfson Microelectronics, said, “We selected Oxford Digital’s TinyCore DSP due to its efficiency at executing certain key High Definition Audio algorithms, which our customers tell us provide them with a differentiator in their market place. Our choice was helped by the ease of its software porting process, excellent power efficiency, scalability and rapid time-to-market, all of which complement our architecture.”
John Richards, CEO of Oxford Digital, said, “Wolfson is a leader in high-quality and low-power mixed-signal audio and we are excited to be working with them on integrating our IP into their products. Our TinyCore audio DSP will enable Wolfson to respond very rapidly to customer requirements and minimise future embedded software maintenance costs due to the structure of our tools.”
About Oxford Digital Limited
Oxford Digital Limited spun out of Sony Corporation’s Pro-Audio Lab, Oxford in July 2006. Since then it has established itself as an innovative technology company providing IP solutions to major international organisations. Oxford Digital specialises in digital audio signal processing for the mobile and consumer equipment and Pro-Audio markets.
Amongst the items in its technology portfolio is a complete end-to-end solution for audio processing for semiconductor manufacturers. This solution includes an extremely compact audio DSP core, a rapid programming and development environment (or direct implementation of fully optimised embedded code from MatLab Simulink simulations), audio effects and back-end tuning tools that allow rapid optimisation of the sonic performance of Consumer Electronics equipment.
For more information about Oxford Digital Limited, please visit:
|
Oxford Digital Limited Hot IP
Related News
- Israeli Semiconductor Consortium Licenses Flex Logix's Embedded FPGA Technology
- Sckipio Licenses and Deploys CEVA-XC Communications DSP in World's First G.fast Chipsets
- Dialog Semiconductor Licenses Cadence's Industry-Leading Tensilica Hifi Audio/Voice DSP IP
- Renesas Licenses Cadence' Tensilica ConnX D2 DSP for Next-Generation IoT Chip
- Realtek Licenses Cadence's Tensilica HiFi Audio/Voice DSP IP Core
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |