Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
SANTA CLARA, CA -- February 09, 2011- mimoOn, a pioneer in LTE (Long Term Evolution) software implementation for programmable radio platform, and Tensilica®, the number one LTE IP (Intellectual Property) core provider, will be demonstrating their market-leading hardware and software for mobile SDR (software-defined radio) baseband at Mobile World Congress, February 14 - 17, 2011, in Barcelona, in Tensilica's booth 1F39 and in mimoOn's pavilion, #99 on the main avenue.
The demonstration showcases mimoOn's mi!MobilePHY software, a full-featured and certified LTE software solution for user equipment (handsets) that supports mandatory and optional features in the 3GPP Release 8 standard. With a flexible and scalable architecture, advanced algorithms and roadmap for future 3GPP releases, mimoOn's mi!MobilePHY adds to the already outstanding features and performance of the Tensilica solution.
The Tensilica-based hardware system showcases Atlas LTE downlink functionality, showing end-to-end video content transfer and playback. The demonstration uses Tensilica's ConnX BBE16 DSP (digital signal processor) core, coupled with the newly introduced ConnX SSP16 and ConnX Turbo16 dataplane processors (DPUs) to implement a complete user equipment LTE PHY downlink system. All required functionality is implemented in the Tensilica cores and there is no need for any external hardware blocks, as in other implementations, since Tensilica DPUs are scalable and can range from small, function-specific micro DPUs/DSPs to high-performance DSPs and can be customized to deliver 10x to 100x speed/power improvements.
"The combination of the Atlas platform and a pre-integrated and validated LTE PHY from mimoOn delivers significant design cycle efficiencies and improves time-to-market for customers, which in 2011, will be a major competitive advantage with the accelerated deployment of LTE," stated Brian Robertson, vice president of sales & marketing at mimoOn.
"Tensilica's reference platform enables customers to quickly and easily implement their LTE design without the need to take care of LTE PHY integration by themselves. Removing this effort from our customers enables them to focus on delivering solutions to the market in an accelerated manner," stated Eric Dewannain, Tensilica's vice president and general manager, Baseband Business Unit.
mimoOn GmbH, headquartered in Dusseldorf, Germany, is a world leading licensor of LTE Software IP for mobile devices & wireless infrastructure. mimoOn's portfolio of products includes Physical Layer (PHY) and Protocol Stack (L2/L3) for mobile phones and devices, small cell basestations (Pico/Femto) and IP development in the areas of SON, schedulers and Radio Resource management.
mimoOn partners with leading silicon & DSP IP vendors, providing a complete HW & SW platform for OEM's to develop and commercialize their products. mimoOn provides a complete porting, optimization and verification service, as well as a roadmap to future 3GPP releases. For more information, visit www.mimoOn.de.
Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane Processor Units (DPUs) combine the best capabilities of DSP and CPU while delivering 10x to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking, wireless base station and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.