MIT, TI tip 28-nm processor
Mark LaPedus, EETimes
2/20/2011 9:05 PM EST
SAN FRANCISCO - At the 2011 International Solid-State Circuits Conference (ISSCC) here, Texas Instruments Inc. and the Massachusetts Institute of Technology (MIT) will outline what could be a major breakthrough in the gap between performance demands and battery capacity in the mobile space.
In a paper, TI and MIT will present research detailing design methodologies for a 28-nm mobile applications processor with ultra-low power. The paper-entitled ''A 28nm 0.6V Low Power Digital Signal Processor (DSP) for Mobile
E-mail This Article | Printer-Friendly Page |
|
Related News
- Fujitsu Semiconductor ASIC Design for 2G/3G/4G Baseband Processor in Volume Production with Synopsys 28-nm MIPI M-PHY
- New Freescale 28-nm QorIQ AMP Series Processors Deliver High-End Features and Ultra-Low-Power Operation
- Adapteva close to sampling 28-nm, 64-core coprocessor
- Altera Introduces SoC FPGAs: Integrating ARM Processor System and FPGA into 28-nm Single-Chip Solution
- Improved ARM core, other changes in TI mobile app processor
Breaking News
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- TSMC Reports First Quarter EPS of NT$8.70
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance