Sony goes 'coreless' in Cell processors
Norihiro Satsukawa, EETimes
3/1/2011 5:09 PM EST
TOKYO – Sony Corp., best known for its consumer products but also a chip supplier, revealed to EE Times Japan that they have been successfully mass-producing high-end processors with coreless substrate packaging technology.
“We started to use coreless packages in mass-production of Cell processors for PlayStation3 since April 2010 and have shipped more than 3 million units,” Tomoshi Ohde, general manager, advanced LSI assembly product department at Sony’s semiconductor business group, said during a recent one-on-one with EE Times Japan.
Ohde claims this level of mass-production of coreless packaged semiconductor products is a worldwide first.
E-mail This Article | Printer-Friendly Page |
Related News
- Chipletz selects Siemens' EDA solutions for its Smart Substrate IC packaging technology
- IBM, Sony, Toshiba tip 'Cell' processor at 90-nm
- IBM, Sony, Sony Computer Entertainment Inc. and Toshiba Unveil Cell Processor; First Details of Multicore Chip Comprising Power Architecture and Synergistic Processors
- Achronix FPGAs Add Support for Bluespec's Linux-capable RISC-V Soft Processors to Enable Scalable Processing
- Hailo Selected VeriSilicon's ISP and Video IP for its AI Vision Processors Empowering Intelligent Surveillance Cameras
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024