3-D ICs stack up design challenges
Ron Wilson, EETimes
4/20/2011 11:24 AM EDT
In an address to the GlobalPress Forum in Santa Cruz on March 29, Mentor Graphics Chairman and CEO Walden Rhines (See picture) outlined the likely evolutionary stages of 3-D IC development, from today's relatively simple stacked dice to a distant future of design in a homogeneous 3-D space. Along that path Rhines identified several points of interest.
To start at the beginning, the first patent on through-silicon via (TSV) technology, Rhines said, was granted to transistor pioneer William Shockley in 1958. From there, the idea of moving signals from the top to the bottom surface of a die by drilling a hole straight through languished until recently, when TSVs became the most popular candidate for moving signals between layers of a 3-D IC.
E-mail This Article | Printer-Friendly Page |
Related News
- Chip execs see 20 nm variants, 3-D ICs ahead
- 3-D Stacking Reaches New Heights : Tachyon Semiconductor Creates Four-Wafer Stack
- Latest Release of Lattice sensAI Solutions Stack Delivers up to 6X Performance Boost on Award-Winning CrossLink-NX FPGAs
- New Cadence Clarity 3D Transient Solver Delivers Up to 10X Faster System-Level EMI Simulation
- GLOBALFOUNDRIES and Arm Demonstrate High-Density 3D Stack Test Chip for High Performance Compute Applications
Breaking News
- JEDEC Updates JESD79-5C DDR5 SDRAM Standard: Elevating Performance and Security for Next-Gen Technologies
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
- Silvaco Announces Expanded Partnership with Micron Technology
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
Most Popular
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Microchip Technology Acquires Neuronix AI Labs
- CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
- Brazil and Europe sign innovative project with RISC-V technology for HPC
- Alphawave Semi - Q4 2023 Trading and Business Update