MIPS Technologies Advances "Apps on MIPS" Development
Launches New MIPS Application Development (MAD) Program Offering Application Performance and Compatibility Testing on MIPS-Based Mobile Devices
SUNNYVALE, Calif. - May 31, 2011-MIPS Technologies, Inc. (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital home, networking and mobile applications, announced the launch of a new MIPS Application Development (MAD) Program designed to promote rapid development of applications on the MIPS® architecture. The program offers technical support and services for performance testing and compatibility to verify that applications will run as designed on MIPS-Based devices. Through the program-the latest offering available through the new MIPS Developer Community-developers can quickly create applications that are fully compatible with MIPS-Based mobile devices to ensure an ideal user experience with their games and other applications.The initial MAD Program is targeted for development of applications for MIPS-Based devices running the Android platform. A dedicated team of MIPS development engineers will provide compatibility and performance analysis, which will be fed back to the application developer. Full documentation and technical support are available through the MIPS Developer Community at developer.mips.com. In addition, developers can take advantage of a MAD Kit for Android application development. The MAD Kit offers a full toolchain comprised of the Android software development kit (SDK) and QEMU emulator, and includes a native development kit (NDK) (r5b Windows/Linux). A premium mobile hardware platform will also be available.
"An increasing number of MIPS licensees are developing smart connected products with Android, including several MIPS-Based Android tablets that are already in the market. Today, consumers already have access to thousands of apps on MIPS. We want to encourage developers to build more apps, and support these developers in testing the performance and compatibility of those apps. We anticipate that developers will optimize their apps across each of the major processor architectures to ensure an optimal user experience on all consumer devices," said Art Swift, vice president of marketing and business development, MIPS Technologies.
For more information on the MAD Program and to request a MAD Kit, visit developer.mips.com.
About MIPS Technologies, Inc.
MIPS Technologies, Inc. (NASDAQ: MIPS) is a leading provider of industry-standard processor architectures and cores for digital home, networking and mobile applications. The MIPS architecture powers some of the world's most popular electronic products, including broadband devices from Linksys, DTVs and digital consumer devices from Sony, DVD recordable devices from Pioneer, digital set-top boxes from Motorola, network routers from Cisco, 32-bit microcontrollers from Microchip Technology and laser printers from Hewlett-Packard. Founded in 1998, MIPS Technologies is headquartered in Sunnyvale, California, with offices worldwide. For more information, contact (408) 530-5000 or visit www.mips.com.
|
Related News
- MIPS Technologies and Green Hills Software Partner To Offer "Best-in-Class" Application Development Environment
- Imperas Collaborates with MIPS and Ashling to Accelerate RISC-V Application Software Development from SoC Concept to Deployment
- Xamarin Adding Support for MIPS Architecture to Popular Mono for Android Application Development Platform
- Dolphin Integration will enable you to save development time for your application program
- MIPS Technologies Simplifies Android Application Development with Tools for the MIPS Architecture
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |