Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
SRS and Tensilica Partnership Offers Turn-Key Leading-Edge Audio Solutions to Chip Manufacturers in the Home Entertainment and Mobile Markets
SANTA ANA, CA-- September 14, 2011 - SRS Labs (NASDAQ: SRSL), the industry leader in surround sound, audio enhancement, and voice post-processing technologies, announced today that it has expanded its audio processing IP portfolio offering for Tensilica processors. Chip manufacturers who license Tensilica's HiFi 2 and HiFi EP DSP cores are now able to quickly implement and license several industry-leading SRS audio technologies including the latest advanced suites for their SoCs (system-on-chips).
"Tensilica's HiFi 2 and HiFi EP DSP cores are the popular choice of our platform partners," said Joanna Skrdlant, Senior Director, Global Platform Partner Program. "Over the course of a year, we've seen a substantial increase in our licensee's projects based upon chips designed with Tensilica HiFi 2 and HiFi EP DSP core solutions. Given this accelerating demand, we made it a top priority to port our latest audio technologies to the HiFi cores."
SRS audio solutions enable equipped products to restore the natural tonality of recorded audio, making music sound true to the original studio recording and movies and games sound like the listener is actually immersed in the action. Unlike competing solutions, SRS technologies do not solely flatten a device's frequency response to overcome speaker limitations. Rather, SRS audio solutions are designed to accurately locate and restore audio cues that go missing or get buried during the compression process and deliver improved full-range fidelity, more pronounced vocals, sculpted bass, an expanded three-dimensional sound stage and virtualized surround sound. Additionally, SRS solutions allow manufacturers to overcome the tinny, restricted sound that results from physical limitations presented by small speakers and non-ideal speaker placement.
Libraries for the following SRS audio solutions are now available to OEMs utilizing Tensilica processors:
- StudioSound HD designed for HDTV applications
- WOW HD® designed for TVs, mobile devices and automotive applications
- TruVolume® designed for TV and automotive applications
- TruSurround HD for TV applications
- CS Headphone for TV, mobile, PC, MP3 Player and other applications
- TruEQ for TV, mobile, PC and automotive applications
- TruGaming for mobile gaming applications
OEM partners of SRS Labs utilizing Tensilica's HiFi Audio DSP also get full access to SRS' engineering team to ensure that every device wearing the SRS logo sounds its absolute best.
"We have worked closely with SRS for many years because they offer a complete lineup of class-leading audio enhancement solutions targeting the home entertainment, mobile and automotive markets," stated Larry Przywara, Tensilica's senior director of multimedia marketing. "We are thrilled that SRS has expanded the range of audio enhancement IP available to our popular Tensilica HiFi Audio DSP IP cores and are confident that our customers will benefit tremendously from having the SRS packages readily available on our cores."
Tensilica's HiFi Audio DSP is the most popular audio DSP core on the market and is licensed by five of the top 10 semiconductor companies and many leading system OEMs. The HiFi Audio DSP solution includes over 80 audio encoders, decoders, and audio-enhancement software packages for efficient audio processing in applications ranging from low power mobile devices -- such as mobile phones and MP3 players -- to high performance home entertainment systems, set-top boxes, Blu-ray Disc players/recorders, and HDTVs. The HiFi Audio DSP is part of Tensilica's growing line of dataplane processors (DPUs) that do the challenging, compute-intensive tasks in SOC (system-on-chip) designs.
Over 40 companies have licensed Tensilica's HiFi audio DSPs, including the following companies that have been publicly announced: Fujitsu, HiSilicon, Ibiquity Digital, Intel, LG Electronics, Novatek, NVIDIA, PnPNetwork, Samsung, Stretch and Wolfson Microelectronics.
Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane processors combine the best capabilities of DSP and CPU while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, storage, networking, wireless base station and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.