Silicon Infusion Announces 3-Layer ISDB-T Demodulator
Ocotober 3, 2011 -- The Zaltys 3-Layer ISDB-T High Performance Demodulator (ISDBT-D) core is now available from Silicon Infusion. It integrates a high performance COFDM demodulation engine, and a fully compliant deframer, to give a complete and flexible ISDB-T demodulation solution. Optional data capture and bit error rate test features make this product ideally suited for use in demanding infrastructure monitoring and test applications.
According to Gianni Nannetti, Managing Director of Silicon Infusion - "This new product is the result of many customer requests that we provide a demodulation solution for ISDB-T, to complement our existing modulator core. This new core means that Silicon Infusion can now offer our customers a complete ISDB-T transmission and reception portfolio, allowing them to source all their needs under one roof". The ISDB-T demodulator core has been undergoing comprehensive testing over the last few months, which it passed with flying colours. Gianni Nannetti added "Our ISDB-T demodulator is already being integrated into designs, and we are looking forward to seeing innovative new products in the market with this core at its heart".
|
Silicon Infusion Ltd. Hot IP
Related News
- Zaltys ISDB-T Demodulator Core brings Digital Broadcast BER Testing Capability to Anritsu Spectrum Master and Cell Master Handheld Analyzers
- Silicon Infusion's HDRM-D2 Demodulator gets 256QAM Option
- T2M-IP Unveils Best-Selling DVB-T2/T Demodulator IP Core with Cutting-Edge Features, Silicon Proven and Ready to License
- CEVA and Idea! Electronic Systems Partner to Deliver Software-Based ISDB-T Solution for DTV Demodulation
- Imagination extends standards supported on ENSIGMA UCCP family with International ISDB-T
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |