TI talks future-proofing for Omap
Sylvie Barak, EETimes
11/3/2011 4:10 PM EDT
MOUNTAIN VIEW, Calif.--Tomorrow’s mobile application processor will not only be capable of rendering holographic displays, high-definition augmented reality, real-time voice translation, natural speech interaction and multi-view synthesis, but may also be able to handle neuro, fuzzy-based and even humanistic intelligence according, to Texas Instruments Inc.
Talking about the capabilities its Omap 4 processor has today and those working their way down the pipeline as Omap 5 approaches sampling readiness in 2012, TI’s Avner Goren, director of strategic marketing for wireless terminals, outlined use case scenarios including smell sensors, environment sensors and multi-mode gesture sensors.
E-mail This Article | Printer-Friendly Page |
|
Related News
- TI to reduce costs in Wireless business; OMAP processors and wireless connectivity solutions will focus on embedded markets
- Does Amazon want TI's OMAP?
- TI steering OMAP to embedded
- EVE's Hardware-Assisted Verification Platform Accelerates Embedded Software Development for Texas Instruments' OMAP 5 Platform
- TI's OMAP platform powers Windows 8 tablets with advanced visual and computing capabilities
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024