CEVA-TeakLite-III DSP Licensed to Toshiba

CEVA's high-performance DSP selected for Toshiba's mobile audio chip and automotive audio DSP product lines

MOUNTAIN VIEW, Calif., Nov. 7, 2011 -- CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that CEVA-TeakLite-III DSP has been licensed by Toshiba Corporation to power its upcoming mobile audio chip and automotive audio DSP product lines. Delivering best-in-class performance for such intensive audio applications, the CEVA-TeakLite-III DSP provides Toshiba with the most advanced and mature 32-bit audio DSP, also named 'best all-around audio processor' in a comprehensive report on DSP cores by The Linley Group^.

"The addition of Toshiba to the growing list of CEVA customers leveraging our programmable DSPs and platforms is indicative of our continued expansion beyond cellular baseband to include the growing markets of high performance audio in mobile and automotive applications," said Gideon Wertheizer, CEO of CEVA. "By exploiting the programmability and flexibility of the CEVA-TeakLite-III, Toshiba can utilize the development resources effectively and maximize technology reuse across their mobile audio chip and automotive audio DSP product lines."

CEVA-TeakLite-III is a native 32-bit, high performance DSP core, used in cellular baseband and application processor chips, to handle, among other tasks, advanced mobile audio scenarios, such as multi-stream audio playback with various post-processing functions for enhanced audio experience. The DSP solution includes a configurable cached memory subsystem, a comprehensive set of certified and optimized HD audio codecs, and complete software development kit, including software development tools, prototype boards, and test chips.

To learn more about CEVA-TeakLite-III, visit www.ceva-dsp.com/ceva-teaklite-iii

About CEVA, Inc.

CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (HD video, Image Signal Processing (ISP) and HD audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA's IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.

^ The Linley Group "A Guide to CPU Cores and Processor IP, Second Edition" by Joseph Byrne and Linley Gwennap, March 2010.

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