32-Bit RISC-V Embedded Processor and Subsystem, Maps ARM M-0 to M-4. Optimal PPA,
A cloudy future for AMD
Jim McGregor, In-Stat
EETimes (2/6/2012 5:48 PM EST)
On the heels of the company’s financial conference, there is a buzz in the air about AMD and its new management team headed by Rory Read.
From the presentation material to the press reports, it would seem that AMD made all the right moves and said all the right things.
The company is re-enforcing its position in the x86 with both CPUs and APUs, continues to push the boundaries and it’s chief competitor Nvidia in graphics, and is targeting embedded applications like digital signage, medical, gaming, communications, and storage with custom SoCs. However, vague references to these new SoC solutions have sparked the rumor mill that AMD could be partnering with ARM or other processor IP vendors for future devices.
While I have been a vocal proponent of AMD seeking a new business strategy focused more on IP than chips, I still see many challenges ahead.
E-mail This Article | Printer-Friendly Page |
Related News
- Arm Collaborates with Industry Leaders to Build AI Foundations of the Future
- Samsung Electronics and AMD Extend Strategic IP Licensing Agreement To Bring AMD Radeon™ Graphics to Future Mobile Platforms
- AMD licenses Mips' 64-bit processor technology for future products
- AMD Selects inSilicon's USB 2.0 Transceiver IP For Future Chips
- China's Intel, AMD Ban Helps Local Rivals, Analysts Say
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process