1-112Gbps Medium Reach (MR) and Very Short Reach (VSR) SerDes
Methodics Announces Support for Latest Release of Subversion Version Control System to Enable More Efficient IC Design
Version 1.7 of popular CM tool brings more performance and enhances distributed use model for large IC design projects
SAN FRANCISCO, Calif. – February 8, 2012 – Methodics, Inc., the leading provider of integrated solutions used in managing design data and semiconductor intellectual property (IP) for complex IC design, today announced that its suite of SoC development tools supports the latest release of the popular Subversion® version control system. The integration provides development teams with an efficient way to manage the hardware and software aspects of large, complex ICs. The Subversion 1.7 release, developed by the Subversion open-source community, is the most complete ever and includes a number of performance improvements, enhancements to both the client and server features, and changes that improve a distributed use model.
The Methodics suite of design data and IP management tools work synergistically with the Subversion platform to manage how a wide range of design data is used, tracked, debugged and archived. The integration of release 1.7 further allows IC designers to fully exploit the features and capabilities of Subversion to see faster and more efficient results for collaborative design methodologies.
“There is a large base of users of the Methodics SoC DM solution that also uses Subversion. The improvements in the latest release of Subversion will make the methodology that the tools enable together to operate even more efficiently, both from a performance standpoint as well as in how disparate design teams can collaborate on projects,” Simon Butler, CEO of Methodics, said. “SoC design is becoming increasingly more like a software development process, and the combination of Methodics’ expertise in IC design and Subversion’s track record of improving software development results in a solution ideally suited for today’s highly integrated SoCs.”
New features, better performance in Subversion 1.7
- HTTPv2 – a new HTTP protocol variant designed to enhance performance between Subversion clients and the server
- A new in-memory caching system for FSFS repository backends
- A range of features that improve its ability to show "diffs," including a new option that is similar to git
- Network compression – a protocol for avoiding CPU bottlenecks on the compression side
- Working copy meta-data cached in a client-side SQLlite database
The modular Methodics architecture allows the addition of tools for managing the design data in a variety of ways, creating a sophisticated collaborative work environment that meets the growing need for communication between multiple sites and design teams, and enables visual comparison and implementation of design changes. Using such industry-standard tools as Subversion 1.7 as the configuration management (CM) database ensures that design data is never locked into a proprietary system, and also makes the entire CM companion tools ecosystem available to facilitate user-specific IP and release methodologies.
About Methodics, Inc.
Methodics, Inc. is a leading provider of design data management (DM) tools that improve the efficiency and collaboration of integrated circuit (IC) design. Its IP Developer™ and SoC Integrator™ systems are components in the first integrated platform for managing SoC realization, reducing the time, complexity and costs involved in IP-based design approaches. Its VersIC™ DM tools integrate industry-standard software configuration management tools, such as the Perforce® and Subversion® version control systems into the hardware design environment to provide a more efficient global collaboration experience. The privately held company has offices in the USA, Europe and Asia. For further information, visit www.methodics.com.
Related News
- Xilinx Ships New Release Of System Generator For DSP Development Tool With Full Support For Latest MatLab & Simulink Software
- Siemens extends support of multiple IC design solutions for TSMC's latest processes
- Siemens extends support of multiple IC design solutions for Samsung Foundry's latest process technologies
- Latest Synopsys IC Compiler II Release Boosts Quality-of-Results for Performance-Critical Designs
- Aldec delivers enhanced UVM Support and New Debugging Features with the latest release of Riviera-PRO
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |