Upgraded PUF-based Crypto Coprocessor (Compliant with TLS 1.3 / FIPS 186-5)
Tensilica's ConnX BBE16 DSP IP Core for Digital Baseband Signal Processing Licensed to Renesas Electronics
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
TOKYO, Japan - April 17, 2012 - Tensilica, Inc. today announced that the ConnX BBE16 DSP (digital signal processing) IP (intellectual property) core has been licensed to Renesas Electronics Corporation for upcoming products for digital broadcasting receivers.
"Renesas is a premier provider of advanced semiconductor solutions and has proven experience in developing products for digital broadcasting receivers. We are proud they have selected our popular ConnX BBE16 DSP core after an extensive evaluation," stated Eric Dewannain, Tensilica's vice president and general manager, Baseband Business Unit. "The ConnX BBE16 DSP is a high-performance, and very efficient, 16-MAC (multiply accumulate) DSP that is ideal for use in products such as home wireless networks, multi-standard broadcast receivers, and digital television demodulators."
More information about the ConnX BBE16 DSP can be found at http://www.tensilica.com/products/dsps/connx-baseband-engine.htm
About Tensilica
Tensilica, Inc. is the leader in dataplane processor IP cores. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
|
Related News
- HiSilicon, a Division of Huawei, Extends License of Tensilica's IP Cores, ConnX Baseband Engine, and HiFi Audio DSP for LTE Base Stations and Handsets
- Renesas Licenses Cadence' Tensilica ConnX D2 DSP for Next-Generation IoT Chip
- Bwave and Ubiso to Demonstrate World's First Licensable Multi-Standard DVB-T2 DTV Demodulation IP Subsystem Based on Tensilica's ConnX BBE16 DSP
- Tensilica HiFi Audio/Voice DSP Licensed to Renesas Electronics
- ClariPhy Licenses Tensilica's Xtensa Dataplane Processor (DPU) for Optical Networking Mixed Signal, Digital Signal Processing (MXSP) SOCs
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Intel and Arm Team Up to Power Startups
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
E-mail This Article | Printer-Friendly Page |