Imagination licenses its Ensigma UCC IP to Qualcomm
April 23, 2012 -- Imagination Technologies Group plc (LSE: IMG; "Imagination"), a leader in System-on-Chip Intellectual Property ("SoC IP"), has signed a license agreement with Qualcomm Incorporated (Nasdaq: QCOM), a world leader in 3G and next-generation mobile technologies, for certain IP from Imagination’s Ensigma UCC broadcast, communications and connectivity IP family.
Under the terms of its licensing arrangements, Imagination receives license fees and royalty revenues.
About Imagination Technologies
Imagination Technologies Group plc (LSE:IMG) – a global leader in multimedia and communication technologies – creates and licenses market-leading multimedia IP cores for graphics, video, and display processing, multi-threaded embedded processing/DSP cores and multi-standard communications and connectivity processors. These silicon intellectual property (IP) solutions for systems-on-chip (SoC) are complemented by platform level IP and services, a strong array of software tools and drivers and extensive developer and middleware ecosystems. Target markets include mobile phone, handheld multimedia, home consumer entertainment, mobile and low-power computing, and in-car electronics. Its licensees include many of the leading semiconductor and consumer electronics companies. Imagination has corporate headquarters in the United Kingdom, with sales and R&D offices worldwide. See: www.imgtec.com.
|
Imagination Technologies Group plc Hot IP
Related News
- Imagination licenses multiple multimedia IP cores to HiSilicon
- Qualcomm becomes Imagination Technologies licensee
- Imagination Technologies licenses PowerVR IP cores to Ricoh
- Imagination Technologies licenses further high-performance graphics processor core to MediaTek
- Imagination's Ensigma IP provides global broadcast TV demodulation in new Qualcomm Snapdragon 802 processor
Breaking News
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
E-mail This Article | Printer-Friendly Page |