TSMC raises capex to record $8.5 billion, pulls in 20-nm
Peter Clarke, EETimes
(4/26/2012 12:23 PM EDT)
LONDON – Taiwan Semiconductor Manufacturing Co. Ltd. has raised its planned capital expenditure for 2012 to between $8 billion and $8.5 billion. The move accompanied the announcement of first quarter financial results and strong second quarter outlook by the foundry.
TSMC (Hsinchu, Taiwan) said that it needed to increase capex because of stronger than expected demand for 28-nm wafers and because it has decided to "pull in" the creation of a 20-nm R&D process line.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Semi Capex on Pace for 34% Growth in 2021 to Record $152.0 Billion
- TSMC Boosts 2016 Capex to About $9.5 Billion
- TSMC Slashes 2015 Capex by over 25% to $8 Billion
- TSMC Cuts Capex by $1 Billion
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
Breaking News
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- TSMC Reports First Quarter EPS of NT$8.70
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance